Intel corporation (20240222301). METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Kyle Arrington of Gilbert AZ (US)

Ziyin Lin of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Sairam Agraharam of Chandler AZ (US)

Ashay Dani of Chandler AZ (US)

Eric J. M. Moret of Beaverton OR (US)

Tarek Ibrahim of Mesa AZ (US)

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222301 titled 'METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES

Simplified Explanation: The patent application describes methods and apparatus for optical thermal treatment in semiconductor packages, specifically focusing on an integrated circuit (IC) package that includes a dielectric substrate, an interconnect, and light absorption material to increase in temperature when exposed to pulsed light for thermal treatment.

• The patent application discloses a semiconductor package with a dielectric substrate.
• An interconnect is associated with the dielectric substrate.
• Light absorption material is located near or around the interconnect.
• The light absorption material increases in temperature in response to pulsed light exposure for thermal treatment.
• The thermal treatment corresponds to the specific IC package being treated.

Potential Applications: 1. Semiconductor manufacturing processes. 2. Thermal treatment of integrated circuit packages. 3. Optoelectronic device fabrication.

Problems Solved: 1. Efficient thermal treatment in semiconductor packages. 2. Enhanced performance and reliability of integrated circuits. 3. Precise control of temperature during manufacturing processes.

Benefits: 1. Improved thermal management in semiconductor devices. 2. Enhanced functionality and longevity of integrated circuits. 3. Increased efficiency in semiconductor manufacturing.

Commercial Applications: Optical thermal treatment technology can be utilized in the semiconductor industry for enhancing the performance and reliability of integrated circuits. This innovation can lead to more efficient manufacturing processes and improved product quality, making it a valuable asset for semiconductor companies looking to optimize their production processes.

Questions about Optical Thermal Treatment in Semiconductor Packages: 1. How does the light absorption material contribute to the thermal treatment process in semiconductor packages? 2. What are the specific advantages of using pulsed light for thermal treatment in integrated circuit packages?

Original Abstract Submitted

methods and apparatus for optical thermal treatment in semiconductor packages are disclosed. a disclosed example integrated circuit (ic) package includes a dielectric substrate, an interconnect associated with the dielectric substrate, and light absorption material proximate or surrounding the interconnect, the light absorption material to increase in temperature in response to being exposed to a pulsed light for thermal treatment corresponding to the ic package.