Intel corporation (20240222298). TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract
Contents
TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222298 titled 'TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING
The patent application discusses technologies for die recycling in high yield packaging. A release layer with conductive pads and a dielectric layer is deposited on the dies, allowing for easy removal and recycling if faults are found in subsequent layers.
- Release layer with conductive pads and dielectric layer
- Melting points of layers between processing temperature and damage temperature
- Redeposition layers deposited on release layer
- Heating up release layer to remove die for recycling
- Cleaning and recycling dies for another packaging attempt
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing
Problems Solved: - Facilitates die recycling in high yield packaging processes - Allows for easy removal of faulty dies for rework
Benefits: - Cost-effective recycling of dies - Reduces waste in semiconductor packaging processes
Commercial Applications: Title: Innovative Die Recycling Technology for High Yield Packaging This technology can be utilized in semiconductor packaging facilities to improve yield rates and reduce production costs. It can also be integrated into electronics manufacturing processes to enhance sustainability and reduce environmental impact.
Questions about Die Recycling Technology: 1. How does the release layer with conductive pads and dielectric layer facilitate die recycling? The release layer allows for easy removal of dies if faults are found in subsequent layers, enabling the recycling of dies for another packaging attempt.
2. What are the potential applications of this die recycling technology? This technology can be applied in the semiconductor packaging industry and electronics manufacturing to improve yield rates and reduce waste.
Original Abstract Submitted
technologies for die recycling for high yield packaging is disclosed. in the illustrative embodiment, a release layer is deposited on one or more dies. the release layer includes conductive pads and a dielectric layer. both the conductive pads and the dielectric layer have melting points between a temperature at which the die assembly will be processed and a temperature at which the die may sustain damage. one or more layers such as redistribution layers are deposited on the release layer. if a fault is discovered in the redistribution layers, the die assembly can be heated up past the melting point of the release layer, allowing the die to be removed. the die can then be cleaned and recycled for another packaging attempt.
