Intel corporation (20240222295). STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract
Contents
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES
Organization Name
Inventor(s)
Mahdi Mohammadighaleni of Phoenix AZ (US)
Joshua Stacey of Chandler AZ (US)
Benjamin T. Duong of Phoenix AZ (US)
Thomas S. Heaton of Mesa AZ (US)
Dilan Seneviratne of Phoenix AZ (US)
Rahul N. Manepalli of Chandler AZ (US)
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222295 titled 'STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES
The patent application describes a microelectronic assembly with a package substrate containing a solid continuous glass material, capacitors, and integrated circuit dies.
- The capacitors in the solid continuous glass material have a dielectric structure composed of organic dielectric material between layers of crystalline inorganic material.
- The crystalline inorganic material directly contacts one of the two conductive structures in each capacitor.
Potential Applications:
- This technology can be used in various microelectronic devices requiring high-performance capacitors.
- It can be applied in industries such as telecommunications, computing, and consumer electronics.
Problems Solved:
- Addresses the need for high-quality capacitors in microelectronic assemblies.
- Provides a solution for improving the performance and reliability of integrated circuits.
Benefits:
- Enhances the efficiency and functionality of microelectronic devices.
- Increases the lifespan and durability of the integrated circuit components.
Commercial Applications:
- This technology has commercial potential in the semiconductor industry for manufacturing advanced microelectronic devices.
Questions about the Technology: 1. How does the use of crystalline inorganic material in the dielectric structure benefit the performance of the capacitors? 2. What specific challenges in microelectronic assembly does this technology aim to overcome?
Frequently Updated Research: There may be ongoing research in the field of microelectronic materials and structures that could further enhance the capabilities of this technology.
Original Abstract Submitted
embodiments described herein enable a microelectronic assembly that includes: a package substrate having a core including a solid continuous glass material with one or more capacitors in the solid continuous glass material and integrated circuit (ic) dies coupled to the package substrate. the structure of each capacitor includes a dielectric structure between two conductive structures. the dielectric structure comprises a layer of organic dielectric material between two layers of crystalline inorganic material. the crystalline inorganic material is in direct contact with one of the two conductive structures.
