Intel corporation (20240222288). SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES

Organization Name

intel corporation

Inventor(s)

David Shia of Portland OR (US)

Timothy Gosselin of Phoenix AZ (US)

Aravindha Antoniswamy of Phoenix AZ (US)

Sergio Antonio Chan Arguedas of Chandler AZ (US)

Elah Bozorg-grayeli of Chandler AZ (US)

Johnny Cook, Jr. of Glendale AZ (US)

Steven Klein of Chandler AZ (US)

Rick Canham of Hillsboro OR (US)

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222288 titled 'SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES

Simplified Explanation: The patent application describes integrated circuit (IC) device substrates and structures designed for mating and aligning with sockets. The IC device includes a frame on and around a substrate, which can be made of materials like glass or silicon. The frame has an alignment feature, such as a notch or hole, to match with a complementary keying feature of a socket. Additionally, a heat spreader may be attached to the IC die and extend beyond the substrate or be connected to the frame. The heat spreader may incorporate a heat pipe. The IC device can be part of an IC system, with the device substrate linked to a system substrate through a socket configured to connect to the frame.

• IC device substrates and structures for mating and aligning with sockets
• Frame on and around a substrate, which may be glass or silicon
• Alignment feature on the frame to match with a keying feature of a socket
• Heat spreader coupled to the IC die, extending beyond the substrate or connected to the frame
• Heat spreader may include a heat pipe
• IC device part of an IC system with the device substrate linked to a system substrate through a socket

Potential Applications: 1. Electronic devices 2. Computer systems 3. Mobile devices 4. Networking equipment 5. Industrial machinery

Problems Solved: 1. Ensuring proper mating and alignment of IC devices with sockets 2. Efficient heat dissipation from IC dies 3. Enhancing the overall performance and reliability of IC systems

Benefits: 1. Improved connectivity and alignment accuracy 2. Enhanced heat dissipation capabilities 3. Increased system reliability and longevity 4. Better overall performance of IC devices

Commercial Applications: Title: Advanced IC Device Substrates for Enhanced Connectivity and Heat Dissipation This technology can be utilized in various industries such as electronics manufacturing, telecommunications, data centers, and automotive electronics. It can improve the efficiency and reliability of electronic systems, leading to better performance and reduced maintenance costs.

Questions about IC Device Substrates and Structures: 1. How does the alignment feature on the frame of the IC device improve connectivity with sockets? 2. What are the advantages of incorporating a heat spreader with a heat pipe in the IC device design?

Original Abstract Submitted

integrated circuit (ic) device substrates and structures for mating and aligning with sockets. an ic device may include a frame on and around a substrate, which may include glass or silicon. the frame may include an alignment feature, such as a notch or hole, to mate with a complementary keying feature of a socket. a heat spreader may be coupled to an ic die and extend beyond the substrate or be coupled to the frame. the heat spreader may include a heat pipe. the ic device may be part of an ic system with the device substrate coupled to a system substrate by a socket configured to mate to the frame.