Intel corporation (20240222286). HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract
Contents
HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES
Organization Name
Inventor(s)
Mohammad Mamunur Rahman of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222286 titled 'HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES
The abstract of this patent application describes electronic packages and methods of forming them. The electronic package includes a die layer with a first side and a second side, a first die, a second die, a bridge on the first side of the die layer, and electrically conductive routing on the second side.
- The electronic package comprises a die layer with a first side and a second side.
- The die layer includes a first die and a second die.
- A bridge on the first side of the die layer communicatively couples the first die to the second die.
- Electrically conductive routing is on the second side of the die layer.
Potential Applications: - Semiconductor industry - Electronics manufacturing - Integrated circuit packaging
Problems Solved: - Efficient communication between multiple dies - Enhanced electrical connectivity in electronic packages
Benefits: - Improved performance of electronic devices - Increased reliability of electronic packages - Cost-effective manufacturing processes
Commercial Applications: Title: Advanced Electronic Packaging Solutions for the Semiconductor Industry This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive electronics, leading to more reliable and high-performance products in the market.
Questions about Electronic Packages: 1. How does the bridge on the die layer improve communication between the first and second dies?
The bridge on the die layer facilitates efficient data transfer and electrical connectivity between the two dies.
2. What are the advantages of having electrically conductive routing on the second side of the die layer?
Electrically conductive routing on the second side enables effective signal transmission and power distribution within the electronic package.
Original Abstract Submitted
embodiments disclosed herein include electronic packages and methods of forming electronic packages. in an embodiment, the electronic package comprises a die layer, with a first side and a second side opposite from the first side. in an embodiment, the die layer comprises a first die, and a second die. in an embodiment, a bridge is on the first side of the die layer, where the bridge communicatively couples the first die to the second die. in an embodiment, electrically conductive routing is on the second side of the die layer.
