Intel corporation (20240222282). ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract
Contents
ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES
Organization Name
Inventor(s)
Srinivas Pietambaram of Chandler AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222282 titled 'ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES
Simplified Explanation: This patent application describes techniques for forming a metallization structure in a glass core package substrate with multiple portions of differing cross-sectional widths, ensuring little to no misalignment between the portions.
Key Features and Innovation:
- Mounting the glass core substrate to a stage
- Applying multiple laser exposures to define laser treated regions corresponding to the portions of the metallization structure
- Removing the laser treated regions
- Filling the openings with metal to form the embedded metallization structure
Potential Applications: This technology can be applied in the manufacturing of glass core package substrates for electronic devices, sensors, and other high-tech applications.
Problems Solved: This technology addresses the challenge of forming a metallization structure with multiple portions of different widths in a glass core package substrate without misalignment.
Benefits:
- Improved precision in forming metallization structures
- Enhanced performance and reliability of electronic devices
- Cost-effective manufacturing process
Commercial Applications: Glass core package substrates with embedded metallization structures can be used in the production of advanced electronic devices, sensors, and microelectronics.
Questions about Glass Core Package Substrates: 1. How does the technology of forming metallization structures in glass core package substrates impact the efficiency of electronic devices? 2. What are the potential cost savings associated with using this innovative manufacturing process for glass core package substrates?
Frequently Updated Research: Ongoing research in the field of glass core package substrates focuses on improving the efficiency and reliability of embedded metallization structures for various electronic applications.
Original Abstract Submitted
apparatuses, systems, assemblies, and techniques related to forming a metallization structure in a glass core package substrate such that the metallization structure has multiple portions with differing cross-sectional widths with little or no misalignment between the portions are described. such techniques including mounting the glass core substrate to a stage, applying multiple laser exposures to a location of the glass core substrate to define laser treated regions of the glass core substrate corresponding to the portions of the metallization structure, removing the laser treated regions, and filling the openings with metal to form the embedded zero misaligned metallization structure.
