Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract
Contents
TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222279 titled 'TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE
Simplified Explanation: The patent application describes technologies for a vertically interconnected glass layer architecture, enabling three-dimensional heterogeneous integration for integrated circuit components.
- Glass layer architecture for integrated circuit components
- Allows for fine pitch connections between dies
- Bridge die embedded in glass layer cavity for interconnects
- Enables vertical integration of integrated circuit dies
- Facilitates connections to other components off the integrated circuit component
Key Features and Innovation: - Vertically interconnected glass layer architecture - Three-dimensional heterogeneous integration - Fine pitch connections between dies - Bridge die embedded in glass layer cavity for interconnects - Enables vertical integration of integrated circuit dies
Potential Applications: - Semiconductor industry - Electronics manufacturing - Integrated circuit design - Microelectronics
Problems Solved: - Limited space for interconnects in traditional integrated circuit designs - Complex routing of connections between dies - Challenges in achieving fine pitch connections
Benefits: - Improved integration of components - Enhanced connectivity between dies - Space-saving design - Facilitates complex circuit designs
Commercial Applications: Title: Vertically Integrated Glass Layer Architecture for Advanced Integrated Circuits Potential commercial uses include: - High-performance computing - Telecommunications equipment - Automotive electronics - Medical devices
Questions about Vertically Integrated Glass Layer Architecture: 1. How does the glass layer architecture improve connectivity in integrated circuit components? 2. What are the advantages of three-dimensional heterogeneous integration in semiconductor devices?
Frequently Updated Research: - Ongoing research in three-dimensional integration techniques - Advancements in glass layer technology for integrated circuits
Original Abstract Submitted
technologies for a vertically interconnected glass layer architecture is disclosed. in the illustrative embodiment, an integrated circuit component includes several integrated circuit dies and a glass layer. integrated circuit dies are positioned both above and below the glass layer. the glass layer has a bridge die embedded in a cavity. the bridge die provides interconnects between the various dies and to other components off of the integrated circuit component. the glass layer can enable three-dimensional heterogeneous integration, allowing for fine pitch connections between dies.
