Intel corporation (20240222272). DOUBLE INTERCONNECTS FOR STITCHED DIES simplified abstract
Contents
DOUBLE INTERCONNECTS FOR STITCHED DIES
Organization Name
Inventor(s)
Abhishek Anil Sharma of Portland OR (US)
Christopher M. Pelto of Beaverton OR (US)
Wilfred Gomes of Portland OR (US)
Tahir Ghani of Portland OR (US)
Anand S. Murthy of Portland OR (US)
DOUBLE INTERCONNECTS FOR STITCHED DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222272 titled 'DOUBLE INTERCONNECTS FOR STITCHED DIES
Simplified Explanation: The patent application describes stitched dies with double interconnects, where an integrated circuit structure includes two separate dies connected by conductive interconnections.
- The first die has a device layer and multiple metallization layers with a conductive interconnection.
- The second die, separated by a scribe region, also has a device layer, metallization layers, and a conductive interconnection that extends over the scribe region to connect with the first die.
Key Features and Innovation:
- Integrated circuit structure with stitched dies and double interconnects.
- Conductive interconnections connecting separate dies.
- Improved connectivity and functionality in integrated circuits.
Potential Applications:
- Semiconductor industry for advanced integrated circuits.
- Electronics manufacturing for improved circuit design.
- Telecommunications for enhanced connectivity in devices.
Problems Solved:
- Enhanced connectivity between separate dies.
- Improved functionality in integrated circuits.
- Better performance in electronic devices.
Benefits:
- Increased efficiency in circuit design.
- Enhanced connectivity between components.
- Improved overall performance of electronic devices.
Commercial Applications: Potential commercial applications include:
- Advanced semiconductor manufacturing.
- Electronics industry for improved device performance.
- Telecommunications sector for enhanced connectivity.
Questions about stitched dies with double interconnects: 1. How do stitched dies with double interconnects improve integrated circuit structures? 2. What are the key advantages of using double interconnects in semiconductor devices?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor technology and integrated circuit design to understand the evolving landscape of stitched dies with double interconnects.
Original Abstract Submitted
stitched dies having double interconnects are described. for example, an integrated circuit structure includes a first die including a first device layer, a first plurality of metallization layers over the first device layer, and a first conductive interconnection over the first plurality of metallization layers. the integrated circuit structure also includes a second die separated from the first die by a scribe region, the second die including a second device layer, a second plurality of metallization layers over the second device layer, and a second conductive interconnection over the second plurality of metallization layers. the second conductive interconnection extends over the scribe region and is coupled to the first conductive interconnection.
