Intel corporation (20240222258). GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract
Contents
GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION
Organization Name
Inventor(s)
Rachel Guia Parala Giron of Mesa AZ (US)
Darko Grujicic of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222258 titled 'GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION
- Simplified Explanation:**
This patent application describes glass substrates with self-assembled monolayers for copper adhesion, along with methods of forming them. In one example, a substrate includes glass layers, a self-assembled monolayer on the glass layers, and a conductive layer with copper on the monolayer.
- Key Features and Innovation:**
- Glass substrates with self-assembled monolayers for copper adhesion
- Method of forming glass substrates with self-assembled monolayers
- Conductive layer with copper on the self-assembled monolayer
- Potential Applications:**
The technology can be used in the electronics industry for various applications such as circuit boards, sensors, and other electronic devices.
- Problems Solved:**
This technology addresses the issue of copper adhesion to glass substrates, providing a reliable and efficient solution for electronic applications.
- Benefits:**
- Improved adhesion of copper to glass substrates
- Enhanced performance and reliability of electronic devices
- Simplified manufacturing processes
- Commercial Applications:**
Glass substrates with self-assembled monolayers for copper adhesion have potential commercial uses in the electronics industry, particularly in the production of circuit boards and sensors. This innovation can lead to more efficient manufacturing processes and higher quality electronic products.
- Questions about Glass Substrates with Self-Assembled Monolayers:**
1. How does the self-assembled monolayer improve copper adhesion to glass substrates? 2. What are the key benefits of using glass substrates with self-assembled monolayers in electronic devices?
Original Abstract Submitted
glass substrates with self-assembled monolayers for copper adhesion, and methods of forming the same, are described herein. in one example, a substrate includes one or more glass layers, a self-assembled monolayer on the one or more glass layers, and a conductive layer on the self-assembled monolayer. the conductive layer includes copper, and the self-assembled monolayer is between the one or more glass layers and the conductive layer.
