Intel corporation (20240222249). INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract

INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES

Organization Name

intel corporation

Inventor(s)

Jeremy D. Ecton of Gilbert AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Brandon Christian Marin of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Oladeji T. Fadayomi of Maricopa AZ (US)

Manuel Gadogbe of Queen Creek AZ (US)

Matthew L. Tingey of Mesa AZ (US)

INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222249 titled 'INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES

The abstract of the patent application describes an integrated circuit package substrate that includes a glass layer with at least one roughened surface and a metal component in contact with the roughened surface.

• Glass layer with roughened surface
• Metal component in contact with roughened surface
• Roughness of the surface above 100 nm
• Potential for improved adhesion and electrical properties
• Enhanced performance and reliability in integrated circuits

Potential Applications: - Semiconductor manufacturing - Electronics industry - Circuit board assembly

Problems Solved: - Improved adhesion between glass and metal components - Enhanced electrical properties - Increased reliability of integrated circuits

Benefits: - Better performance of integrated circuits - Enhanced durability and longevity - Improved manufacturing processes

Commercial Applications: Title: Enhanced Integrated Circuit Package Substrates for Improved Performance Description: This technology can be utilized in the semiconductor and electronics industries to enhance the performance and reliability of integrated circuits, leading to improved products and manufacturing processes.

Questions about the technology: 1. How does the roughened surface of the glass layer improve adhesion with the metal component? - The roughened surface increases the contact area between the glass and metal, enhancing adhesion. 2. What are the potential implications of this technology in the electronics industry? - This technology could lead to more reliable and efficient electronic devices, benefiting consumers and manufacturers alike.

Original Abstract Submitted

in one embodiment, an integrated circuit package substrate includes a glass layer having at least one roughened surface (e.g., with an average roughness above 100 nm) and a metal (e.g., a metal trace or metal via) in contact with the roughened surface of the glass layer.