Intel corporation (20240222248). ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER simplified abstract
Contents
ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER
Organization Name
Inventor(s)
Brandon Christian Marin of Gilbert AZ (US)
Sashi Shekhar Kandanur of Phoenix AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Jeremy D. Ecton of Gilbert AZ (US)
ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222248 titled 'ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER
Simplified Explanation: The patent application discusses architectures and methods for laminating metal on a glass layer or glass core, utilizing dummy anchors to prevent delamination of conductive materials from the glass surfaces.
- The architectures implement dummy anchors to hold conductive pads and material planes down to the glass surface.
- Various combinations of end anchors and through glass via (TGV) anchors are included in the architecture.
Key Features and Innovation:
- Implementation of dummy anchors to prevent or reduce delamination of conductive materials from glass surfaces.
- Use of end anchors and through glass via (TGV) anchors to secure conductive pads and material planes to the glass surface.
Potential Applications: The technology can be applied in the manufacturing of electronic devices, touchscreens, solar panels, and other glass-based products requiring conductive materials.
Problems Solved: The technology addresses the issue of delamination of conductive materials from glass surfaces, ensuring better adhesion and durability of the metal lamination.
Benefits:
- Improved adhesion of conductive materials to glass surfaces.
- Enhanced durability and reliability of glass-based products.
- Cost-effective manufacturing processes for electronic devices and other products.
Commercial Applications: The technology can be utilized in the production of smartphones, tablets, smartwatches, and other electronic devices with glass components, enhancing their performance and longevity.
Prior Art: Readers can explore prior patents related to metal lamination on glass surfaces to gain a deeper understanding of the existing technology in this field.
Frequently Updated Research: Researchers may find updated studies on the adhesion properties of conductive materials on glass surfaces, further enhancing the development of this technology.
Questions about Metal Lamination on Glass Surfaces: 1. How does the use of dummy anchors improve the adhesion of conductive materials on glass surfaces? 2. What are the potential challenges in implementing end anchors and through glass via (TGV) anchors in metal lamination processes on glass?
Original Abstract Submitted
architectures and methods for metal lamination on a glass layer or glass core. the architectures implement dummy anchors to prevent or reduce the delamination of conductive materials from glass surfaces. the anchors hold the conductive pads and conductive material planes down to the glass surface. the architecture includes various combinations of end anchors and through glass via (tgv) anchors.
