Intel corporation (20240222238). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Ziyin Lin of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222238 titled 'APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY

The abstract describes an integrated circuit device substrate made of glass with specific regions and layers on its major surfaces.

• The substrate has a plateau region, a cavity region, and a wall separating them.
• The first major surface has a dielectric region and conductive pillars in the plateau region.
• The second major surface has a dielectric layer with a dielectric-free window under the cavity region.

Potential Applications: - This technology can be used in the manufacturing of integrated circuit devices. - It can be applied in the production of advanced electronic components.

Problems Solved: - Provides a stable and reliable substrate for integrated circuit devices. - Offers a structure that enhances the performance of electronic components.

Benefits: - Improved reliability and stability of integrated circuit devices. - Enhanced performance and functionality of electronic components.

Commercial Applications: Title: Advanced Substrate Technology for Integrated Circuits This technology can be utilized in the semiconductor industry for the production of high-performance electronic devices. It can also benefit companies involved in the development of cutting-edge technologies.

Questions about Integrated Circuit Device Substrate: 1. How does the presence of conductive pillars in the plateau region impact the performance of the integrated circuit device? - The conductive pillars help in providing electrical connectivity and support within the device, enhancing its overall functionality. 2. What advantages does using a glass substrate offer compared to other materials in the manufacturing of integrated circuit devices? - Glass substrates provide excellent thermal and chemical stability, making them ideal for electronic applications.

Original Abstract Submitted

an integrated circuit device substrate includes a glass substrate with a first major surface comprising a plateau region, a cavity region, and a wall between the plateau region and the cavity region. the first major surface includes thereon a first dielectric region, and the plateau region includes a plurality of conductive pillars. a second major surface of the glass substrate opposite the first major surface includes thereon a second dielectric layer, wherein the second dielectric layer includes at least one dielectric-free window underlying the cavity region.