Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract

PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES

Organization Name

intel corporation

Inventor(s)

Gang Duan of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Brandon Marin of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Yang Wu of Chandler AZ (US)

Minglu Liu of Chandler AZ (US)

Yosuke Kanaoka of Chandler AZ (US)

PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222219 titled 'PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES

Simplified Explanation: The patent application describes microelectronic integrated circuit package structures with a first die, a second die, and a bridge structure connecting them. The first die and second die are surrounded by different thermally conductive mold materials on opposite sides of the interface.

• The patent application focuses on microelectronic integrated circuit package structures.
• It involves a first die, a second die, and a bridge structure connecting them.
• The first die and second die are surrounded by different thermally conductive mold materials on opposite sides of the interface.
• The innovation aims to improve thermal conductivity and structural integrity in microelectronic packaging.

Potential Applications: 1. Advanced electronic devices requiring efficient heat dissipation. 2. High-performance computing systems. 3. Aerospace and defense electronics. 4. Automotive electronics for improved reliability in harsh environments.

Problems Solved: 1. Enhanced thermal management in microelectronic packages. 2. Increased structural stability and reliability. 3. Improved performance of electronic devices under high thermal loads.

Benefits: 1. Better heat dissipation capabilities. 2. Enhanced overall performance and reliability of electronic systems. 3. Extended lifespan of microelectronic devices. 4. Improved efficiency in demanding applications.

Commercial Applications: Title: Advanced Thermal Management Solutions for Microelectronic Devices This technology can be utilized in: 1. Consumer electronics such as smartphones and laptops. 2. Industrial automation systems. 3. Medical devices requiring precise temperature control. 4. Telecommunications infrastructure for improved data processing.

Questions about Microelectronic Integrated Circuit Package Structures: 1. How does the use of different thermally conductive mold materials benefit the overall performance of microelectronic packages? 2. What specific challenges in thermal management are addressed by the bridge structure in this innovation?

Frequently Updated Research: Ongoing research in materials science and microelectronics may lead to further advancements in thermal management solutions for microelectronic devices. Stay updated on industry developments to leverage the latest technologies in electronic packaging.

Original Abstract Submitted

microelectronic integrated circuit package structures include a first die and a second die both coupled to a bridge structure at an interface. a first thermally conductive mold material is on a first side of the interface and surrounds the first die and the second die. a second mold material is on a second, opposing side of the interface and surrounds the bridge structure.