Intel corporation (20240222216). PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract
Contents
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
Organization Name
Inventor(s)
Zhixin Xie of Chandler AZ (US)
Jung Kyu Han of Chandler AZ (US)
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222216 titled 'PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
The abstract of this patent application describes electronic packages that include a package substrate with a die connected to it by multiple interconnects. Additionally, there is a first layer surrounding the die on the package substrate, and a second layer over and around the die. The second layer underfills the interconnects and has a different material composition than the first layer.
- The electronic package includes a package substrate with a die connected by interconnects.
- There are two layers - a first layer surrounding the die and a second layer over and around the die.
- The second layer underfills the interconnects and has a different material composition than the first layer.
Potential Applications: - This technology can be used in the manufacturing of electronic devices such as smartphones, tablets, and computers. - It can also be applied in the automotive industry for vehicle electronics.
Problems Solved: - Provides a more efficient and reliable way to connect dies to package substrates. - Enhances the overall performance and durability of electronic packages.
Benefits: - Improved connectivity and reliability of electronic components. - Enhanced performance and longevity of electronic devices.
Commercial Applications: Title: Advanced Electronic Packaging Technology for Enhanced Device Performance This technology can be utilized by electronics manufacturers to improve the quality and reliability of their products, leading to increased customer satisfaction and market competitiveness.
Questions about Electronic Packages: 1. How does the second layer in the electronic package contribute to its overall performance? The second layer underfills the interconnects, providing stability and durability to the electronic package.
2. What are the potential cost savings associated with implementing this electronic packaging technology? By enhancing the reliability of electronic components, manufacturers can reduce warranty claims and improve customer satisfaction, leading to long-term cost savings.
Original Abstract Submitted
embodiments disclosed herein include electronic packages. in an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. in an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. in an embodiment, the second layer underfills the plurality of interconnects, and the second layer has a different material composition than the first layer.
