Intel corporation (20240222211). IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract

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IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS

Organization Name

intel corporation

Inventor(s)

Peumie Abeyratne Kuragama of Chandler AZ (US)

Dilan Seneviratne of Phoenix AZ (US)

Whitney Bryks of Tempe AZ (US)

IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222211 titled 'IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS

The patent application pertains to IC device packages with a low-CTE polymer dielectric build-up material containing a filler with a negative CTE. These low-CTE build-up materials have a CTE below 10 ppm/K below the glass transition temperature of the polymer resin.

  • The innovation involves using a filler with a negative CTE to counteract the expansion of the polymer resin during thermal cycles.
  • By incorporating a negative CTE filler, the expansion of the polymer resin can be partially offset, leading to improved stability during thermal fluctuations.

Potential Applications:

  • This technology can be applied in the manufacturing of IC device packages to enhance their reliability and performance.
  • It can also find use in other electronic components where thermal stability is crucial.

Problems Solved:

  • Addresses the issue of polymer resin expansion during thermal cycles, which can lead to reliability issues in IC device packages.
  • Provides a solution to minimize the impact of thermal fluctuations on the performance of electronic components.

Benefits:

  • Improved reliability and stability of IC device packages.
  • Enhanced performance of electronic components in varying thermal conditions.

Commercial Applications:

  • The technology can be utilized in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics, to ensure their longevity and reliability.

Questions about the technology: 1. How does the negative CTE filler help in countering the expansion of the polymer resin? 2. What are the potential long-term benefits of using low-CTE build-up materials in electronic components?


Original Abstract Submitted

ic device packages including a low-cte polymer dielectric build-up material comprising a filler having a negative cte. low cte build-up materials may have a cte less than 10 ppm/k below the glass transition temperature (t) of the polymer resin containing the filler. with a negative cte filler, polymer resin expansion during thermal cycles (e.g., resin cure) may be at least partially countered through negative thermal expansion of the filler.

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