Intel corporation (20240222178). ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS simplified abstract
Contents
ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS
Organization Name
Inventor(s)
Robert Chroneos, Jr. of Chandler AZ (US)
ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222178 titled 'ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS
The abstract describes designs for an electrostatic wafer chuck used for holding and heating semiconductor wafers.
- Metal base
- Temperature sensor
- Multi-layer ceramic plate with bonding layer, heater, dielectrics, electrode, heat spreader, and temperature sensor
- Electrostatically holds semiconductor wafer
- Uniformly distributes heat
- Temperature sensor extends through the metal base and ceramic plate
Potential Applications: - Semiconductor manufacturing - Wafer processing - Thin film deposition
Problems Solved: - Securely holding and heating semiconductor wafers - Ensuring uniform heat distribution - Monitoring and controlling temperature accurately
Benefits: - Improved wafer processing efficiency - Enhanced temperature control - Increased yield and quality of semiconductor devices
Commercial Applications: Title: "Advanced Electrostatic Wafer Chuck for Semiconductor Manufacturing" This technology can be used in semiconductor fabrication facilities to enhance wafer processing and improve the quality of semiconductor devices. The market implications include increased production efficiency and higher-quality output.
Prior Art: Researchers can explore prior patents related to electrostatic wafer chucks, semiconductor wafer heating technologies, and temperature control systems in semiconductor manufacturing.
Frequently Updated Research: Researchers may find updated studies on ceramic materials for wafer chucks, advancements in temperature sensing technologies, and innovations in semiconductor manufacturing processes.
Questions about Electrostatic Wafer Chuck: 1. How does the design of the electrostatic wafer chuck contribute to semiconductor manufacturing efficiency? 2. What are the key factors to consider when selecting materials for the ceramic plate in an electrostatic wafer chuck?
Original Abstract Submitted
this disclosure describes electrostatic wafer chuck designs for holding and heating semiconductor wafers. an electrostatic wafer chuck may include a metal base; a temperature sensor; and a multi-layer ceramic plate including: a bonding layer; a heater; a first dielectric positioned between the heater and the bonding layer; an electrode to electrostatically hold a semiconductor wafer; a second dielectric positioned between the heater and the electrode; a heat spreader to uniformly distribute heat from the heater to the semiconductor wafer; and a third dielectric positioned between the electrode and the semiconductor wafer; and a temperature sensor may extend through the metal base and at least partially through the multi-layer ceramic plate.
