Intel corporation (20240222139). MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES simplified abstract
Contents
MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES
Organization Name
Inventor(s)
Suddhasattwa Nad of Chandler AZ (US)
Brandon Marin of Gilbert AZ (US)
Jeremy Ecton of Gilbert AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222139 titled 'MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES
Simplified Explanation: The patent application describes microelectronic integrated circuit package structures with a unique solder joint structure involving different metals and an intermetallic compound.
Key Features and Innovation:
- First portion on a die made of a first metal
- Second portion on a substrate with an inner portion made of a second metal and an outer portion made of an intermetallic compound of the first and second metals
Potential Applications: This technology can be applied in the manufacturing of microelectronic integrated circuit packages for various electronic devices.
Problems Solved: This technology addresses the need for reliable and efficient solder joint structures in microelectronic integrated circuit packages.
Benefits: The benefits of this technology include improved reliability, performance, and longevity of microelectronic integrated circuit packages.
Commercial Applications: Potential commercial applications include the production of high-quality electronic devices with enhanced performance and durability.
Prior Art: Readers can explore prior research on microelectronic integrated circuit package structures and solder joint technologies to understand the evolution of this field.
Frequently Updated Research: Stay informed about the latest advancements in microelectronic integrated circuit package structures and solder joint technologies for cutting-edge electronic devices.
Questions about microelectronic integrated circuit package structures: 1. What are the key components of a solder joint structure in microelectronic integrated circuit packages? 2. How does the use of different metals and intermetallic compounds impact the performance of solder joint structures in electronic devices?
Original Abstract Submitted
microelectronic integrated circuit package structures include a solder joint structure having a first portion on a die and a second portion on a substrate. the first portion comprises a first metal. an inner portion of the second portion comprises a second metal, and an outer portion of the second portion comprises an intermetallic compound (imc) of the first and second metals.
