Intel corporation (20240222035). PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

Organization Name

intel corporation

Inventor(s)

Suddhasattwa Nad of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Gang Duan of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Brandon Marin of Gilbert AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Jason Steill of Phoenix AZ (US)

Thomas Sounart of Chandler AZ (US)

Darko Grujicic of Chandler AZ (US)

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222035 titled 'PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

The abstract describes apparatuses, capacitor structures, assemblies, and techniques related to package substrate embedded capacitors. A capacitor architecture includes a multi-layer capacitor structure within an opening in an insulative material layer of a package substrate or on a package substrate. The multi-layer capacitor structure consists of at least two capacitor dielectric layers interleaved with conductive layers, with the dielectric layers partially within the opening and one conductive layer on a sidewall of the opening.

• The innovation involves embedding capacitor structures within package substrates, enhancing the integration of capacitors into electronic devices.
• The multi-layer capacitor structure allows for efficient use of space and improved performance in electronic circuits.
• By interleaving capacitor dielectric layers with conductive layers, the design achieves high capacitance in a compact form factor.
• Placing the capacitor structure within an opening in the substrate enables better thermal management and electrical connectivity.
• This technology offers a novel approach to incorporating capacitors into electronic packaging, potentially leading to more compact and efficient devices.

Potential Applications: - Consumer electronics - Automotive electronics - Industrial automation - Telecommunications equipment

Problems Solved: - Space constraints in electronic devices - Thermal management issues - Electrical connectivity challenges

Benefits: - Improved performance of electronic circuits - Space-saving design - Enhanced reliability and durability

Commercial Applications: Title: "Integrated Capacitor Structures for Enhanced Electronic Devices" This technology could be utilized in the development of smaller, more efficient electronic devices across various industries, leading to cost savings and improved functionality.

Questions about Package Substrate Embedded Capacitors: 1. How does embedding capacitors within package substrates benefit electronic device design?

  - Embedding capacitors within package substrates allows for more compact and efficient electronic devices, optimizing space utilization and improving performance.

2. What advantages does the multi-layer capacitor structure offer over traditional capacitor designs?

  - The multi-layer capacitor structure provides higher capacitance in a smaller form factor, enabling better integration into electronic circuits and systems.

Original Abstract Submitted

apparatuses, capacitor structures, assemblies, and techniques related to package substrate embedded capacitors are described. a capacitor architecture includes a multi-layer capacitor structure at least partially within an opening extending through an insulative material layer of a package substrate or on a package substrate. the multi-layer capacitor structure includes at least two capacitor dielectric layers interleaved with a plurality of conductive layers such that the capacitor dielectric layers are at least partially within the opening and one of the conductive layers are on a sidewall of the opening.