Intel corporation (20240219660). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Eric J.M. Moret of Beaverton OR (US)

Robert Alan May of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Tarek A. Ibrahim of Mesa AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Bin Mu of Tempe AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240219660 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation: The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals for improved signal integrity and manufacturability.

Key Features and Innovation:

• Semiconductor device with photonic die and glass substrate.
• Turning mirrors used to direct optical signals.
• Configurations of turning mirrors enhance signal integrity and manufacturability.

Potential Applications: This technology could be applied in various fields such as telecommunications, data transmission, and optical computing.

Problems Solved: The technology addresses the need for improved signal integrity and manufacturability in semiconductor devices.

Benefits:

• Enhanced signal integrity.
• Improved manufacturability.
• Increased efficiency in optical signal transmission.

Commercial Applications: Potential commercial applications include telecommunications equipment, data centers, and optical computing devices.

Prior Art: Readers can explore prior art related to semiconductor devices, photonic die, turning mirrors, and optical signal transmission technologies.

Frequently Updated Research: Stay informed about the latest advancements in semiconductor devices, photonic technology, and optical signal transmission research.

Questions about Semiconductor Devices with Turning Mirrors: 1. What are the key components of a semiconductor device with turning mirrors? 2. How do turning mirrors improve signal integrity in optical signal transmission systems?

1. A relevant generic question not answered by the article, with a detailed answer: How do turning mirrors in semiconductor devices contribute to signal optimization and efficiency? Turning mirrors in semiconductor devices play a crucial role in directing optical signals between the photonic die and glass substrate, ensuring signal integrity and improving manufacturability. By strategically positioning these mirrors, the technology can enhance the efficiency of optical signal transmission.

2. Another relevant generic question, with a detailed answer: What are the potential applications of semiconductor devices with turning mirrors? Semiconductor devices with turning mirrors have diverse applications in telecommunications, data transmission, and optical computing. These devices can be used in various industries where high-speed and reliable optical signal transmission is essential for efficient operations.

Original Abstract Submitted

a semiconductor device and associated methods are disclosed. in one example, the electronic device includes a photonic die and a glass substrate. in selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. configurations of turning mirrors are provided to improve signal integrity and manufacturability.