Intel corporation (20240219659). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

intel corporation

Inventor(s)

Ziyin Lin of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Haobo Chen of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Robert Alan May of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240219659 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation: The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

Key Features and Innovation:

• Semiconductor device with photonic die and glass substrate.
• Turning mirrors used to direct optical signals.
• Configurations of turning mirrors improve signal integrity and manufacturability.

Potential Applications: The technology could be applied in telecommunications, data transmission, optical networking, and sensor systems.

Problems Solved: The technology addresses the need for efficient and reliable optical signal transmission between components in semiconductor devices.

Benefits: Improved signal integrity, enhanced manufacturability, and potentially higher performance in optical communication systems.

Commercial Applications: The technology could be utilized in the telecommunications industry, data centers, optical networking equipment, and sensor devices.

Prior Art: Readers can start searching for prior art related to this technology by looking into patents or research papers on semiconductor devices with integrated photonic components and turning mirrors for optical signal manipulation.

Frequently Updated Research: Stay updated on advancements in semiconductor devices with integrated photonics and turning mirrors for improved signal transmission efficiency.

Questions about Semiconductor Devices with Turning Mirrors: 1. What are the primary advantages of using turning mirrors in semiconductor devices for optical signal manipulation? 2. How does the integration of photonic components enhance the performance of semiconductor devices in optical communication systems?

Original Abstract Submitted

a semiconductor device and associated methods are disclosed. in one example, the electronic device includes a photonic die and a glass substrate. in selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. configurations of turning mirrors are provided to improve signal integrity and manufacturability.