Intel corporation (20240219656). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

intel corporation

Inventor(s)

Ziyin Lin of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Haobo Chen of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Robert Alan May of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240219656 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation:

The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

• The electronic device includes a photonic die and a glass substrate.
• One or more turning mirrors are used to direct optical signals between the photonic die and the glass substrate.
• Configurations of turning mirrors are optimized to enhance signal integrity and manufacturability.

Key Features and Innovation:

• Utilization of turning mirrors to improve signal transmission between the photonic die and glass substrate.
• Enhanced signal integrity and manufacturability through optimized configurations of turning mirrors.

Potential Applications:

This technology can be applied in various fields such as telecommunications, data transmission, and optical computing.

Problems Solved:

• Improved signal integrity in semiconductor devices.
• Enhanced manufacturability of devices with photonic components.

Benefits:

• Enhanced signal transmission efficiency.
• Improved reliability of semiconductor devices.
• Simplified manufacturing processes.

Commercial Applications:

Potential commercial applications include optical communication systems, data centers, and high-speed computing devices.

Prior Art:

Readers can explore prior art related to semiconductor devices, photonic components, and optical signal transmission technologies.

Frequently Updated Research:

Stay updated on advancements in semiconductor devices, photonic technologies, and optical communication systems for potential improvements and innovations.

Questions about Semiconductor Devices with Turning Mirrors:

1. What are the primary advantages of using turning mirrors in semiconductor devices? 2. How do turning mirrors contribute to improving signal integrity in photonic components?

Original Abstract Submitted

a semiconductor device and associated methods are disclosed. in one example, the electronic device includes a photonic die and a glass substrate. in selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. configurations of turning mirrors are provided to improve signal integrity and manufacturability.