Intel corporation (20240219655). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

intel corporation

Inventor(s)

Haobo Chen of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Dingying Xu of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240219655 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation: The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

Key Features and Innovation:

• Semiconductor device with photonic die and glass substrate.
• Turning mirrors used to direct optical signals.
• Configurations of turning mirrors designed for signal integrity and manufacturability.

Potential Applications: This technology could be applied in:

• Telecommunications
• Data centers
• Optical networking

Problems Solved: The technology addresses issues related to signal integrity and manufacturability in semiconductor devices.

Benefits:

• Improved signal integrity
• Enhanced manufacturability
• Efficient optical signal transmission

Commercial Applications: Potential commercial uses include:

• Optical communication equipment
• Semiconductor manufacturing industry
• Research and development in photonics

Prior Art: Readers can explore prior art related to semiconductor devices, photonic dies, and turning mirrors in optical systems.

Frequently Updated Research: Stay updated on advancements in semiconductor devices, photonic technology, and optical signal transmission research.

Questions about Semiconductor Devices with Turning Mirrors: 1. What are the key components of a semiconductor device with turning mirrors? 2. How do turning mirrors improve signal integrity in optical systems?

Original Abstract Submitted

a semiconductor device and associated methods are disclosed. in one example, the electronic device includes a photonic die and a glass substrate. in selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. configurations of turning mirrors are provided to improve signal integrity and manufacturability.