Intel corporation (20240219654). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

intel corporation

Inventor(s)

Ziyin Lin of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Haobo Chen of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Robert Alan May of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240219654 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation

The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

• The semiconductor device includes a photonic die and a glass substrate.
• Turning mirrors are used to direct optical signals between the photonic die and the glass substrate.
• Different configurations of turning mirrors are provided to enhance signal integrity and manufacturability.

Key Features and Innovation

• Integration of a photonic die and a glass substrate in a semiconductor device.
• Use of turning mirrors to efficiently direct optical signals between components.
• Various configurations of turning mirrors to optimize signal integrity and manufacturing processes.

Potential Applications

The technology can be applied in:

• Telecommunications
• Data centers
• Optical networking

Problems Solved

• Improved signal integrity in semiconductor devices.
• Enhanced manufacturability of devices.
• Efficient optical signal transmission.

Benefits

• Enhanced performance of semiconductor devices.
• Increased reliability of optical signal transmission.
• Simplified manufacturing processes.

Commercial Applications

Title: Semiconductor Device with Turning Mirrors for Optical Signal Transmission This technology can be utilized in various commercial applications such as telecommunications equipment, data center infrastructure, and optical networking devices. It can improve signal integrity, enhance performance, and streamline manufacturing processes in these industries.

Questions about Semiconductor Device with Turning Mirrors for Optical Signal Transmission

A relevant generic question not answered by the article, with a detailed answer

How do turning mirrors improve signal integrity in semiconductor devices? Turning mirrors are strategically placed to efficiently direct optical signals between components, reducing signal loss and interference, thus enhancing signal integrity in the device.

Another relevant generic question, with a detailed answer

What are the potential applications of a semiconductor device with turning mirrors? This technology can be applied in telecommunications, data centers, and optical networking for improved signal transmission, enhanced performance, and simplified manufacturing processes.

Original Abstract Submitted

a semiconductor device and associated methods are disclosed. in one example, the electronic device includes a photonic die and a glass substrate. in selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. configurations of turning mirrors are provided to improve signal integrity and manufacturability.