Intel corporation (20240219629). PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES simplified abstract
Contents
PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES
Organization Name
Inventor(s)
Changhua Liu of Chandler AZ (US)
Robert May of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240219629 titled 'PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES
The patent application describes methods, apparatus, systems, and articles of manufacture that utilize photonic integrated circuits with glass cores.
- Glass core primary package substrate with first contacts on the outer surface.
- Photonic integrated circuit (PIC) located within the primary package substrate next to the glass core.
- Secondary package substrate supporting a semiconductor die with second contacts on the opposite side.
- Electrical coupling between the first contacts and second contacts.
Potential Applications: - Optical communication systems - Data transmission networks - High-speed computing devices
Problems Solved: - Enhanced signal transmission efficiency - Improved reliability and durability of integrated circuits
Benefits: - Increased data transfer speeds - Reduced signal loss - Enhanced overall performance of electronic devices
Commercial Applications: Title: "Next-Generation Optical Communication Systems" This technology can be utilized in the development of faster and more reliable optical communication systems, catering to the increasing demand for high-speed data transmission in various industries.
Questions about the technology: 1. How does the use of glass cores in photonic integrated circuits improve signal transmission efficiency? 2. What are the potential challenges in implementing this technology in commercial electronic devices?
Original Abstract Submitted
methods, apparatus, systems, and articles of manufacture are disclosed utilizing photonic integrated circuits with glass cores. an example apparatus comprises a primary package substrate including a glass core and first contacts along an outer surface of the primary package substrate, a photonic integrated circuit (pic) within the primary package substrate adjacent a surface of the glass core, and a secondary package substrate supporting a semiconductor die on a first side of the secondary package substrate, the secondary package substrate including second contacts on a second side of the secondary package substrate, the first contacts electrically coupled to the second contacts.
