Intel corporation (20240217216). ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES simplified abstract

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

Organization Name

intel corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Tarek A. Ibrahim of Mesa AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Dilan Seneviratne of Chandler AZ (US)

Jieying Kong of Chandler AZ (US)

Thomas Heaton of Gilbert AZ (US)

Whitney Bryks of Tempe AZ (US)

Vinith Bejugam of Chandler AZ (US)

Junxin Wang of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240217216 titled 'ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

The abstract of this patent application describes package substrates with glass stiffeners. The package substrate includes a first layer made of glass, a second layer of buildup film, and an electrically conductive interconnect structure through both layers.

• Glass stiffeners are incorporated into package substrates.
• The first layer of the package substrate is made of glass.
• A second layer of buildup film is added over the first layer.
• An electrically conductive interconnect structure runs through both layers.

Potential Applications: - Electronic packaging - Semiconductor devices - Microelectronics industry

Problems Solved: - Enhanced structural integrity - Improved electrical connectivity - Increased reliability in electronic devices

Benefits: - Strengthened package substrates - Enhanced electrical performance - Greater durability in electronic components

Commercial Applications: Glass stiffened package substrates can be used in various electronic devices, such as smartphones, tablets, and computers, to improve their performance and reliability in demanding applications.

Questions about Glass Stiffened Package Substrates: 1. How do glass stiffeners improve the structural integrity of package substrates? 2. What are the advantages of using glass stiffeners in electronic packaging?

Original Abstract Submitted

embodiments disclosed herein include package substrates with glass stiffeners. in an embodiment, the package substrate comprises a first layer, where the first layer comprises glass. in an embodiment, the package substrate comprises a second layer over the first layer, where the second layer is a buildup film. in an embodiment, the package substrate further comprises an electrically conductive interconnect structure through the first layer and the second layer.