Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract
ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF
Organization Name
Inventor(s)
Long Thanh Nguyen of Ho Chi Minh City (VN)
Tin Do of Ho Chi Minh City (VN)
Le Hoai Bao Nguyen of Dong Nai (VN)
Phu Tuc Nguyen of Ho Chi Minh City (VN)
Hung Quy Soi of Ho Chi Minh City (VN)
ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240217122 titled 'ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF
Abstract: This disclosure describes enhanced substrate transfer arm (STA) and pedestal designs related to a thermal compression bonding process. The designs include multiple row patterns of the STA and the pedestal used to pick up a first substrate row from a first row of a tray; place the first substrate row onto a first row of a bond stage corresponding to the first row of the tray; pick up a second substrate row from the tray; place, using the suction cups, the second substrate row onto a remaining empty row of the bond stage; pick up the first substrate row after thermal bonding from the bond stage; place the first substrate row after thermal bonding onto the tray; when all substrates from the tray have been thermally bonded, pick up a last substrate row after thermal bonding from the bond stage; and place the last substrate row onto the tray.
Key Features and Innovation:
- Enhanced substrate transfer arm (STA) and pedestal designs
- Multiple row patterns for efficient substrate handling
- Suction cups for precise placement of substrates
- Automation of thermal compression bonding process
- Improved productivity and accuracy in bonding substrates
Potential Applications: - Semiconductor manufacturing - Microelectronics assembly - Optoelectronics production - MEMS fabrication - Printed circuit board assembly
Problems Solved: - Inefficient substrate handling - Lack of precision in substrate placement - Manual errors in the bonding process - Low productivity in thermal compression bonding - Inconsistencies in substrate bonding quality
Benefits: - Increased efficiency in substrate handling - Enhanced precision in substrate placement - Automation of bonding process for improved accuracy - Higher productivity in thermal compression bonding - Consistent and high-quality substrate bonding results
Commercial Applications: Title: Enhanced Substrate Transfer Arm and Pedestal Designs for Thermal Compression Bonding Description: This technology can be utilized in semiconductor manufacturing, microelectronics assembly, and other industries requiring precise substrate bonding processes. The enhanced designs offer improved efficiency, accuracy, and productivity in thermal compression bonding applications, leading to cost savings and enhanced product quality.
Questions about Enhanced Substrate Transfer Arm and Pedestal Designs for Thermal Compression Bonding: 1. How do the multiple row patterns of the substrate transfer arm enhance substrate handling efficiency? 2. What are the key benefits of using suction cups for substrate placement in the bonding process?
Original Abstract Submitted
this disclosure describes enhanced substrate transfer arm (sta) and pedestal designs related to a thermal compression bonding process. the designs include multiple row patterns of the sta and the pedestal used to: pick up a first substrate row from a first row of a tray; place the first substrate row onto a first row of a bond stage corresponding to the first row of the tray; pick up a second substrate row from the tray; place, using the suction cups, the second substrate row onto a remaining empty row of the bond stage; pick up the first substrate row after thermal bonding from the bond stage; place the first substrate row after thermal bonding onto the tray; when all substrates from the tray have been thermally bonded, pick up a last substrate row after thermal bonding from the bond stage; and place the last substrate row onto the tray.
