Intel corporation (20240215269). GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240215269 titled 'GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

The abstract describes an electronic system with a glass core layer containing a cavity for active component dies, buildup layers, and solder bumps for interconnection.

• Glass core layer with cavity for active component die
• Buildup layers for electrical interconnects
• Solder bumps for connection to active component die
• Substrate as the base of the electronic system
• Integration of active components within the glass core layer

Potential Applications: - Microelectronics - Semiconductor industry - Integrated circuits

Problems Solved: - Efficient packaging of active components - Improved electrical interconnectivity - Enhanced reliability of electronic systems

Benefits: - Higher integration density - Enhanced performance - Improved thermal management

Commercial Applications: Title: Advanced Packaging Technology for Microelectronics This technology can be used in the development of high-performance electronic devices, such as smartphones, tablets, and computers, where compact size and high functionality are essential.

Prior Art: Researchers can explore prior patents related to advanced packaging technologies in the semiconductor industry to understand the evolution of such systems.

Frequently Updated Research: Researchers in the field of microelectronics and semiconductor packaging are constantly working on improving the efficiency and reliability of electronic systems through innovative packaging technologies.

Questions about Advanced Packaging Technology for Microelectronics: 1. How does this technology improve the reliability of electronic systems? - The technology enhances reliability by providing efficient packaging and interconnectivity for active components. 2. What are the potential challenges in implementing this advanced packaging technology? - Some challenges may include thermal management and ensuring proper alignment of components during assembly.

Original Abstract Submitted

an electronic system includes a substrate that includes a glass core layer including a cavity formed through the glass core layer; at least one active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer and a first surface of the at least one active component die, wherein the first buildup layer includes electrically conductive interconnect contacting the at least one active component die and extending to a first surface of the substrate; a second buildup layer contacting a second surface of the glass core layer and a second surface of the at least one active component die; and one or more solder bumps on a second surface of the substrate and contacting the second surface of the at least one active component die.