Intel corporation (20240215256). INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS simplified abstract
Contents
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS
Organization Name
Inventor(s)
Abhishek Anil Sharma of Portland OR (US)
Tahir Ghani of Portland OR (US)
Anand S. Murthy of Portland OR (US)
Wilfred Gomes of Portland OR (US)
Pushkar Ranade of San Jose CA (US)
Sagar Suthram of Portland OR (US)
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240215256 titled 'INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS
Simplified Explanation: The patent application describes structures with backside capacitors in an integrated circuit, where a front side structure includes select transistors, metallization layers, and vias, while a backside structure includes a memory layer connected to the select transistors through the vias.
- The integrated circuit structure includes a front side structure with select transistors, metallization layers, and vias.
- A backside structure below the vias includes a memory layer connected to the select transistors.
- The backside capacitors enhance the performance and functionality of the integrated circuit.
Potential Applications: 1. Memory storage devices 2. Microprocessors 3. Embedded systems
Problems Solved: 1. Improved performance and functionality of integrated circuits 2. Enhanced memory storage capabilities 3. Increased efficiency in data processing
Benefits: 1. Higher memory capacity 2. Faster data processing speeds 3. Enhanced overall performance of electronic devices
Commercial Applications: The technology can be utilized in the development of advanced memory storage devices, microprocessors, and embedded systems, catering to various industries such as consumer electronics, telecommunications, and automotive.
Prior Art: Readers can explore prior patents related to backside capacitors in integrated circuits to understand the evolution of this technology and its applications.
Frequently Updated Research: Stay updated on the latest advancements in backside capacitor technology in integrated circuits to leverage cutting-edge innovations in electronic device design and manufacturing.
Questions about Backside Capacitors in Integrated Circuits: 1. How do backside capacitors impact the performance of integrated circuits? 2. What are the key differences between front side and backside structures in integrated circuits?
Original Abstract Submitted
structures having backside capacitors are described. in an example, an integrated circuit structure includes a front side structure including a device layer having a plurality of select transistors, a plurality of metallization layers above the plurality of select transistors, and a plurality of vias below and coupled to the plurality of select transistors. a backside structure is below the plurality of vias of the device layer. the backside structure includes a memory layer coupled to the plurality of select transistors by the plurality of vias.
