Intel corporation (20240213328). DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract
Contents
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES
Organization Name
Inventor(s)
Vinith Bejugam of Chandler AZ (US)
Yonggang Li of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Chandrasekharan Nair of Mesa AZ (US)
Whitney Bryks of Tempe AZ (US)
Gene Coryell of Maricopa AZ (US)
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213328 titled 'DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES
The patent application describes a package substrate with a core that has a via opening through it, including sidewalls with a composite layer containing carbon.
- The package substrate includes a core with a via opening through it.
- The via opening has sidewalls with a composite layer that contains carbon.
- The package substrate also has a via within the via opening, which is electrically conductive.
Potential Applications: This technology could be used in electronic packaging, semiconductor devices, and integrated circuits where reliable electrical connections are crucial.
Problems Solved: This innovation addresses the need for improved electrical connectivity and reliability in package substrates used in electronic components.
Benefits: The use of a composite layer containing carbon in the sidewalls of the via opening enhances electrical conductivity and overall performance of the package substrate.
Commercial Applications: This technology could be valuable in the manufacturing of various electronic devices, leading to more efficient and reliable products in the market.
Questions about the Package Substrate Technology: 1. How does the composite layer with carbon in the sidewalls improve electrical conductivity? 2. What are the specific advantages of having a via within the via opening in the package substrate?
Original Abstract Submitted
embodiments disclosed herein include a package substrate. in an embodiment, the package substrate comprises a core with a via opening through the core. in an embodiment, the via opening comprises sidewalls. in an embodiment, a composite layer is provided along the sidewalls, and the composite layer comprises carbon. in an embodiment, the package substrate further comprises a via within the via opening, where the via is electrically conductive.
