Intel corporation (20240213301). THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

Organization Name

intel corporation

Inventor(s)

Darko Grujicic of Chandler AZ (US)

Thomas L. Sounart of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Mahdi Mohammadighaleni of Phoenix AZ (US)

Marcel Wall of Phoenix AZ (US)

Rengarajan Shanmugam of Tempe AZ (US)

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213301 titled 'THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

The abstract of the patent application describes a package core that includes a core substrate made of glass, with a cavity provided in the substrate. The cavity is lined with a capacitor consisting of a first layer, a dielectric layer, and a second layer.

• The package core includes a core substrate made of glass.
• A cavity is present in the core substrate.
• The cavity is lined with a capacitor comprising a first layer, a dielectric layer, and a second layer.

Potential Applications: - This technology could be used in electronic devices requiring capacitors in a compact form. - It may find applications in the semiconductor industry for integrated circuits.

Problems Solved: - Provides a compact solution for integrating capacitors into electronic devices. - Offers a way to enhance the performance of electronic components.

Benefits: - Space-saving design for electronic devices. - Improved performance and efficiency in electronic circuits.

Commercial Applications: Title: Innovative Package Core Technology for Enhanced Electronic Devices This technology could be utilized in the production of smartphones, tablets, and other consumer electronics to improve their performance and reduce space constraints.

Questions about Package Core Technology: 1. How does the use of a glass core substrate benefit the overall design of electronic devices? Glass core substrates offer high thermal stability and excellent electrical properties, making them ideal for electronic applications.

2. What advantages does the capacitor lining the cavity provide in terms of performance and efficiency? The capacitor lining helps improve the electrical characteristics of the package core, enhancing the overall performance of electronic devices.

Original Abstract Submitted

embodiments disclosed herein include a package core. in an embodiment, the package core comprises a core substrate that includes glass. in an embodiment, a cavity is provided into the core substrate. in an embodiment, a capacitor is lining sidewalls of the cavity, and the capacitor comprises a first layer, a dielectric layer over the first layer, and a second layer over the dielectric layer.