Intel corporation (20240213235). ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
Contents
- 1 ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Integrated Circuit Power Device
- 1.13 Original Abstract Submitted
ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES
Organization Name
Inventor(s)
Suddhasattwa Nad of Chandler AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Brandon Marin of Gilbert AZ (US)
Jeremy Ecton of Gilbert AZ (US)
ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213235 titled 'ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES
Simplified Explanation
The patent application describes an apparatus that includes an integrated circuit logic device and an integrated circuit power device connected to it. The power device extends beyond the logic device, with vias and conductive contacts facilitating the connection.
- Integrated circuit logic device
- Integrated circuit power device extending beyond logic device
- Vias and conductive contacts for connection
Key Features and Innovation
- Integrated circuit power device extends laterally beyond integrated circuit logic device
- Vias facilitate connection between power device and logic device
- Conductive contacts on the second surface of the integrated circuit logic device
Potential Applications
This technology could be used in various electronic devices that require efficient power management and connectivity.
Problems Solved
This technology addresses the need for a compact and efficient way to connect power devices to logic devices in integrated circuits.
Benefits
- Improved power management
- Compact design
- Efficient connectivity
Commercial Applications
- Semiconductor industry
- Electronics manufacturing
- Power management systems
Prior Art
Prior art related to this technology may include patents or research on integrated circuit design and power management in electronic devices.
Frequently Updated Research
Researchers are constantly exploring new ways to improve power management and connectivity in integrated circuits, which may impact the development of this technology.
Questions about Integrated Circuit Power Device
What are the potential applications of this technology in the semiconductor industry?
This technology could be used in various electronic devices that require efficient power management and connectivity, such as smartphones, tablets, and computers.
How does this technology improve power management in integrated circuits?
By extending the power device beyond the logic device and using vias for connection, this technology allows for more efficient power distribution and management within the integrated circuit.
Original Abstract Submitted
an apparatus is provided which comprises: an integrated circuit logic device, an integrated circuit power device conductively coupled with a first surface of the integrated circuit logic device, wherein the integrated circuit power device extends laterally beyond a side of the integrated circuit logic device, one or more vias adjacent the side of the integrated circuit logic device extending from contact with the integrated circuit power device to level with a second surface of the integrated circuit logic device opposite the first surface of the integrated circuit logic device, and conductive contacts on the second surface of the integrated circuit logic device. other embodiments are also disclosed and claimed.
