Intel corporation (20240213225). PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract

PACKAGE STACKING USING CHIP TO WAFER BONDING

Organization Name

intel corporation

Inventor(s)

Georg Seidemann of Landshut (DE)

Klaus Reingruber of Langquaid (DE)

Christian Geissler of Teugn (DE)

Sven Albers of Regensburg (DE)

Andreas Wolter of Regensburg (DE)

Marc Dittes of Regensburg (DE)

Richard Patten of Langquaid (DE)

PACKAGE STACKING USING CHIP TO WAFER BONDING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213225 titled 'PACKAGE STACKING USING CHIP TO WAFER BONDING

Simplified Explanation: The patent application focuses on package stacking using chip to wafer bonding, involving multiple stacked layers of semiconductor dies and dielectric layers.

Key Features and Innovation:

• Package stacking using chip to wafer bonding
• Multiple stacked layers of semiconductor dies and components
• Thinning of stacked layers to specific thicknesses
• Fabrication of second stacked layer on top of the first stacked layer

Potential Applications: This technology could be used in the semiconductor industry for advanced packaging solutions, such as in microprocessors, memory devices, and other integrated circuits.

Problems Solved: This technology addresses the need for compact and efficient packaging of semiconductor components, enabling higher performance and functionality in electronic devices.

Benefits:

• Improved performance and functionality of electronic devices
• Enhanced packaging density and efficiency
• Cost-effective manufacturing processes

Commercial Applications: The technology could be applied in the production of high-performance computing devices, mobile devices, and IoT devices, potentially impacting the semiconductor packaging market.

Prior Art: Readers interested in prior art related to this technology could explore research papers, patents, and industry publications on chip to wafer bonding and advanced packaging techniques in the semiconductor field.

Frequently Updated Research: Researchers in the semiconductor industry are continually exploring new materials and processes to enhance package stacking and chip to wafer bonding technologies for improved performance and reliability.

Questions about Package Stacking Using Chip to Wafer Bonding: 1. How does package stacking using chip to wafer bonding differ from traditional packaging methods? 2. What are the key advantages of using chip to wafer bonding in semiconductor packaging?

Original Abstract Submitted

embodiments are generally directed to package stacking using chip to wafer bonding. an embodiment of a device includes a first stacked layer including one or more semiconductor dies, components or both, the first stacked layer further including a first dielectric layer, the first stacked layer being thinned to a first thickness; and a second stacked layer of one or more semiconductor dies, components, or both, the second stacked layer further including a second dielectric layer, the second stacked layer being fabricated on the first stacked layer.