Intel corporation (20240213201). Innovative Interconnect Design for Package Architecture to Improve Latency simplified abstract
Contents
Innovative Interconnect Design for Package Architecture to Improve Latency
Organization Name
Inventor(s)
MD Altaf Hossain of Portland OR (US)
Ankireddy Nalamalpu of Portland OR (US)
Dheeraj Subbareddy of Portland OR (US)
Innovative Interconnect Design for Package Architecture to Improve Latency - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213201 titled 'Innovative Interconnect Design for Package Architecture to Improve Latency
Simplified Explanation: The integrated circuit described in the patent application includes a package substrate with multiple configurable dies arranged in rows and columns. The electrical traces on the substrate connect the dies to improve signal transmission speed.
- The integrated circuit features a package substrate with first and second electrical traces.
- It includes four configurable dies mounted on the substrate in two rows and two columns.
- The first and third dies are connected by the first electrical trace, while the second and fourth dies are connected by the second electrical trace.
- The second electrical trace is positioned obliquely to the first trace, enhancing signal transmission speed between the dies.
Potential Applications: This technology can be applied in various electronic devices requiring high-speed signal transmission, such as smartphones, tablets, and computers. It can also be beneficial in data centers and networking equipment.
Problems Solved: The technology addresses the issue of signal latency between configurable dies in an integrated circuit, improving overall circuit operating speed and efficiency.
Benefits: - Increased signal transmission speed - Enhanced circuit operating speed - Improved efficiency in electronic devices
Commercial Applications: This technology has significant commercial potential in the semiconductor industry, particularly in the development of high-performance electronic devices. It can also be valuable for companies specializing in data processing and networking solutions.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching advancements in integrated circuit design, signal transmission optimization, and configurable die technologies.
Frequently Updated Research: Researchers are continually exploring ways to further enhance signal transmission speed and efficiency in integrated circuits. Stay updated on the latest developments in semiconductor technology and electronic design.
Questions about Integrated Circuit Technology: 1. How does the oblique positioning of electrical traces improve signal transmission speed between configurable dies? 2. What are the potential limitations of this technology in terms of scalability and compatibility with different electronic devices?
Original Abstract Submitted
an integrated circuit includes a package substrate that includes first and second electrical traces. the integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. the first and second configurable dies are arranged in a first row. the third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. the first and third configurable dies are arranged in a first column. the second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. the first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. the second electrical trace is oblique with respect to the first electrical trace. the oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.
