Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING
Organization Name
Inventor(s)
Jung Kyu Han of Chandler AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213198 titled 'UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING
Simplified Explanation: The electronic package described in the patent application consists of two dies connected by interconnects with solder and metal features. The second die's interconnects have a layer of iron between the solder and metal feature, different from the material of the first die's interconnects.
Key Features and Innovation:
- Electronic package with interconnects containing solder and metal features.
- Second die's interconnects have a layer of iron between solder and metal feature.
- Different material composition in the second die's interconnects compared to the first die's interconnects.
Potential Applications: This technology could be used in various electronic devices and systems that require reliable interconnects with improved material composition.
Problems Solved:
- Enhanced reliability of interconnects in electronic packages.
- Improved material composition for better performance.
Benefits:
- Increased durability and reliability of electronic packages.
- Enhanced performance and longevity of electronic devices.
- Potential cost savings in manufacturing processes.
Commercial Applications: Potential commercial applications include the manufacturing of electronic devices, semiconductor products, and other high-tech equipment where reliable interconnects are crucial for performance.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of electronic packaging, semiconductor manufacturing, and materials science.
Frequently Updated Research: Stay updated on the latest advancements in electronic packaging materials, interconnect technologies, and semiconductor manufacturing processes for potential improvements in this technology.
Questions about Electronic Package Technology: 1. What are the key components of the electronic package described in the patent application? 2. How does the material composition of the second die's interconnects differ from the first die's interconnects?
Original Abstract Submitted
an electronic package comprises a first die having at least one first interconnect with solder over or under a first metal feature. a second die has at least one second interconnect to the first die, each second interconnect comprising a second metal feature comprising copper, solder over or under the second metal feature, and a layer between the solder and the second metal feature, wherein the layer comprises iron and has a different material than material of the first interconnect.
