Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

Organization Name

intel corporation

Inventor(s)

Tomita Yoshihiro of Tsukuba-shi (JP)

Eric J. Li of Chandler AZ (US)

Shawna M. Liff of Scottsdale AZ (US)

Javier A. Falcon of Chandler AZ (US)

Joshua D. Heppner of Chandler AZ (US)

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213171 titled 'ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

The patent application describes molded modules and methods for forming them, which can be integrated into electrical packages. These electrical packages may include a die with a redistribution layer on at least one surface, with the molded module mounted to the die. The molded module consists of a mold layer encapsulating multiple components, with terminals from each component being coplanar with the mold layer's surface for electrical coupling to the redistribution layer. Through mold vias may be included in the mold layer for power delivery, and Faraday cages may surround components.

• Molded modules and methods for forming them
• Integration of molded modules into electrical packages
• Die with redistribution layer and mounted molded module
• Mold layer encapsulating components with coplanar terminals
• Through mold vias for power delivery and Faraday cages for component protection

Potential Applications

The technology can be applied in various electronic devices and systems that require compact and efficient electrical packaging solutions. It can be used in consumer electronics, automotive electronics, medical devices, and telecommunications equipment.

Problems Solved

The technology addresses the need for compact and reliable electrical packaging solutions for electronic components. It provides a way to efficiently integrate multiple components into a single module while ensuring proper electrical coupling and protection.

Benefits

- Compact and efficient electrical packaging - Reliable electrical coupling between components - Enhanced protection for components with Faraday cages - Simplified manufacturing process for electronic devices

Commercial Applications

Title: Advanced Electrical Packaging Technology for Enhanced Device Performance The technology can be commercialized in the semiconductor industry for the production of advanced electronic devices with improved performance and reliability. It can also benefit manufacturers of consumer electronics, automotive systems, and medical devices looking to enhance the functionality and durability of their products.

Questions about the Technology

What are the key features of the molded modules described in the patent application?

The molded modules consist of a mold layer encapsulating multiple components with coplanar terminals for electrical coupling to a redistribution layer on a die.

How can the technology benefit the semiconductor industry?

The technology offers a compact and efficient solution for integrating multiple components into a single module, enhancing device performance and reliability in semiconductor applications.

Original Abstract Submitted

embodiments of the invention include molded modules and methods for forming molded modules. according to an embodiment the molded modules may be integrated into an electrical package. electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. the molded module may be mounted to the die. according to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.