Intel corporation (20240213170). GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Brandon C. Marin of Gilbert AZ (US)

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213170 titled 'GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

The abstract of the patent application describes an electronic system with a substrate containing a glass core layer and a top surface active component die. The substrate also includes a discrete passive component and a mold layer with an active component die. The buildup layer connects the active component dies and the passive component.

• Glass core layer with active component die and discrete passive component
• Mold layer with active component die
• Buildup layer connecting all components
• Top surface active component die electrically connected to mold layer active component die

Potential Applications: - Integrated circuits - Electronic devices - Semiconductor manufacturing

Problems Solved: - Efficient electronic system integration - Enhanced electrical connectivity - Space-saving design

Benefits: - Improved performance - Compact design - Simplified manufacturing process

Commercial Applications: Title: Advanced Electronic System Integration for Semiconductor Devices This technology can be used in the production of various electronic devices, such as smartphones, tablets, and computers. It can also benefit the semiconductor industry by streamlining manufacturing processes and improving overall product performance.

Questions about the technology: 1. How does the glass core layer contribute to the overall functionality of the electronic system? The glass core layer provides a stable base for the active component die and helps in efficient heat dissipation.

2. What advantages does the mold layer offer in terms of electronic system integration? The mold layer allows for additional active component dies to be included in the system, increasing its functionality and versatility.

Original Abstract Submitted

an electronic system includes a substrate and a top surface active component die. the substrate includes a glass core layer having a glass core layer active component die disposed in a cavity and a discrete passive component disposed in another cavity; a mold layer including a mold layer active component die disposed in the mold layer; and a buildup layer contacting a top surface of the glass core layer and a bottom surface of the mold layer. the buildup layer includes electrically conductive interconnect connecting the glass core layer active component die, the discrete passive component, and the mold layer active component die. the top surface of the component die is electrically connected to the mold layer active component die.