Intel corporation (20240213169). LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Brandon C. Marin of Gilbert AZ (US)

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213169 titled 'LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

The abstract describes an electronic system with a substrate containing a glass core layer and a cavity, a glass core layer active component die, buildup layers, and a mold layer with an active component die. The system also includes a top surface active component die connected to the mold layer active component die.

• Glass core layer with a cavity for housing active component die
• Buildup layers for electrical connectivity
• Mold layer with active component die for additional functionality
• Top surface active component die for overall system connectivity

Potential Applications: - Electronic devices - Semiconductor industry - Integrated circuits

Problems Solved: - Enhancing electrical connectivity - Improving functionality in electronic systems

Benefits: - Increased efficiency in electronic systems - Enhanced performance of devices - Streamlined manufacturing processes

Commercial Applications: Title: "Advanced Electronic System for Enhanced Connectivity" This technology can be utilized in the production of various electronic devices, improving their performance and functionality. It has implications for the semiconductor industry and integrated circuit manufacturing.

Prior Art: Readers can explore prior patents related to electronic systems, glass core layers, and active component dies to understand the evolution of this technology.

Frequently Updated Research: Stay informed about the latest advancements in electronic systems, glass core layer technology, and active component die integration to remain at the forefront of innovation.

Questions about the Technology: 1. How does this electronic system improve connectivity in devices? 2. What are the potential implications of using glass core layers in electronic systems?

Original Abstract Submitted

an electronic system includes a substrate and a top surface active component die. the substrate includes a glass core layer including a cavity formed through the glass core layer; a glass core layer active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer; a second buildup layer contacting a second surface of the glass core layer; and a mold layer contacting a surface of the first buildup layer. the mold layer includes a mold layer active component die disposed in the mold layer, and the first buildup layer includes electrically conductive interconnect providing electrical continuity between the glass core layer active component die and the mold layer active component die. the top surface active component die is attached to the top surface of the substrate and electrically connected to the mold layer active component die.