Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract

TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS

Organization Name

intel corporation

Inventor(s)

Minglu Liu of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Liang He of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Elizabeth Nofen of Phoenix AZ (US)

Yiqun Bai of Chandler AZ (US)

Jonathan Atkins of Phoenix AZ (US)

Jesus S. Nieto Pescador of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213164 titled 'TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS

The abstract of the patent application describes an electronic package with a package substrate, an opening in the substrate, first pads at the bottom of the opening, a bridge die in the opening, second pads on the bridge die connected to the first pads with solder, and a non-conductive film (NCF) around the solder.

• Package includes a substrate with an opening, first pads, a bridge die, second pads, solder, and NCF.
• Bridge die is positioned in the opening and has second pads connected to first pads via solder.
• NCF surrounds the solder between the first and second pads.

Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.

Problems Solved: - Provides a reliable and efficient way to connect components within an electronic package. - Ensures proper electrical connections between different parts of the package. - Enhances the overall performance and durability of electronic devices.

Benefits: - Improved reliability and stability of electronic packages. - Enhanced electrical connectivity between components. - Increased efficiency and performance of electronic devices.

Commercial Applications: - This technology can be utilized by electronics manufacturers to improve the quality and reliability of their products. - It can also benefit companies in the automotive, medical, and industrial sectors looking to enhance the performance of their electronic systems.

Questions about the Technology: 1. How does the non-conductive film (NCF) contribute to the reliability of the solder connections? 2. What are the advantages of using a bridge die in electronic packages compared to other methods of component connection?

Original Abstract Submitted

embodiments disclosed herein include an electronic package. in an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. in an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. in an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. in an embodiment, a non-conductive film (ncf) is around the solder between the first pads and the second pads.