Intel corporation (20240213163). INTERCONNECT DEVICE AND METHOD simplified abstract
Contents
INTERCONNECT DEVICE AND METHOD
Organization Name
Inventor(s)
Jung Kyu Han of Chandler AZ (US)
INTERCONNECT DEVICE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213163 titled 'INTERCONNECT DEVICE AND METHOD
Simplified Explanation: The patent application discloses an electronic device with vertical connections containing a layer of tin between the connections and conductive traces.
Key Features and Innovation:
- Vertical connections with tin layer between connections and conductive traces
- Tin layer used in conjunction with other interface layers
- Tin layer used in all vertical connections
Potential Applications: This technology could be applied in various electronic devices requiring efficient vertical connections.
Problems Solved: This technology addresses the need for reliable and efficient vertical connections in electronic devices.
Benefits: The benefits of this technology include improved performance and reliability of vertical connections in electronic devices.
Commercial Applications: Potential commercial applications include the manufacturing of electronic devices with enhanced vertical connections, leading to improved overall performance and reliability in the market.
Questions about the Technology 1. How does the tin layer improve the efficiency of vertical connections in electronic devices? 2. What are the advantages of using a tin layer in all vertical connections?
Frequently Updated Research: There may be ongoing research on optimizing the composition and thickness of the tin layer for vertical connections in electronic devices.
Original Abstract Submitted
an electronic device and associated methods are disclosed. in one example, the electronic device includes vertical connections with a layer including tin between the vertical connections and conductive traces. in selected examples, a layer including tin is used in conjunction with other interface layers. in selected examples, a layer including tin is used in all vertical connections.
