Intel corporation (20240213156). LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

Organization Name

intel corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Tarek A. Ibrahim of Mesa AZ (US)

Aaron Garelick of Chandler AZ (US)

Srikant Nekkanty of Chandler AZ (US)

Ravindranath V. Mahajan of Chandler AZ (US)

Rahul N. Manepalli of Chandler AZ (US)

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213156 titled 'LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

The patent application describes package substrates with a core and buildup layers, including pads and liquid metal wells.

• Simplified Explanation:

The patent application discusses package substrates with core and buildup layers, featuring pads and liquid metal wells.

• Key Features and Innovation:

- Package substrate design with core and buildup layers - Inclusion of pads on buildup layers - Liquid metal wells over the pads

• Potential Applications:

- Semiconductor packaging - Electronic device manufacturing - Microelectronics industry

• Problems Solved:

- Enhanced connectivity in package substrates - Improved thermal management - Increased reliability in electronic devices

• Benefits:

- Higher performance in electronic devices - Better heat dissipation - Increased durability of package substrates

• Commercial Applications:

- Semiconductor industry - Consumer electronics manufacturing - Telecommunications sector

• Questions about Package Substrates:

1. How do package substrates with liquid metal wells improve thermal management? 2. What are the advantages of using buildup layers in package substrates?

• Frequently Updated Research:

- Ongoing studies on the impact of liquid metal wells on thermal conductivity in package substrates.

Original Abstract Submitted

embodiments disclosed herein include package substrates. in an embodiment, the package substrate comprises a core and buildup layers over the core. in an embodiment, a pad is provided on the buildup layers. in an embodiment, a liquid metal well is over the pad.