Intel corporation (20240213132). THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

Organization Name

intel corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Darko Grujicic of Chandler AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Mahdi Mohammadighaleni of Phoenix AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Thomas L. Sounart of Chandler AZ (US)

Marcel Wall of Phoenix AZ (US)

Ravindranath V. Mahajan of Chandler AZ (US)

Rahul N. Manepalli of Chandler AZ (US)

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213132 titled 'THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

Simplified Explanation: The electronic package described in the patent application includes a package substrate with multiple stacked dielectric layers, an opening passing through some of these layers, a first pad at the bottom of the opening, a capacitor inside the opening, and a second pad above the capacitor.

• The electronic package comprises a package substrate with multiple stacked dielectric layers.
• An opening is present in the package substrate, passing through at least two of the dielectric layers.
• A first pad is located at the bottom of the opening.
• A capacitor is positioned within the opening.
• A second pad is situated over the capacitor.

Potential Applications: 1. This technology can be used in various electronic devices requiring compact and efficient packaging. 2. It can be applied in the semiconductor industry for advanced integrated circuits. 3. The electronic package can find applications in consumer electronics, telecommunications, and automotive systems.

Problems Solved: 1. Provides a compact and efficient electronic packaging solution. 2. Enables the integration of multiple components in a small space. 3. Enhances the performance and reliability of electronic devices.

Benefits: 1. Improved packaging density and space utilization. 2. Enhanced electrical performance and signal integrity. 3. Increased reliability and longevity of electronic components.

Commercial Applications: Advanced Electronic Packaging Solutions for Semiconductor Industry

Questions about Electronic Package: 1. How does the presence of multiple dielectric layers in the package substrate impact the overall performance of the electronic package? 2. What are the potential challenges in manufacturing electronic packages with openings passing through dielectric layers?

Original Abstract Submitted

embodiments disclosed herein include an electronic package. in an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of stacked dielectric layers. in an embodiment, the electronic package further comprises an opening into the package substrate, where the opening passes through at least two of the plurality of dielectric layers. in an embodiment, a first pad is at the bottom of the opening, a capacitor is disposed in the opening, and a second pad is over the capacitor.