Intel corporation (20240213116). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES simplified abstract

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES

Organization Name

intel corporation

Inventor(s)

Kyle Arrington of Gilbert AZ (US)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213116 titled 'METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES

The patent application discloses methods, systems, apparatus, and articles of manufacture for cooling integrated circuit packages with glass substrates. The example glass core of an integrated circuit package includes a fluid inlet, a fluid outlet, and a channel to allow cooling fluid to flow through from the inlet to the outlet, isolated from vias extending between surfaces of the glass core.

• Glass core of an integrated circuit package with cooling fluid inlet and outlet
• Channel to allow cooling fluid flow through the glass core
• Vias are fluidly isolated from the channel
• Cooling system for integrated circuit packages with glass substrates
• Enhanced cooling efficiency for integrated circuits

Potential Applications: - Cooling systems for high-performance integrated circuits - Electronics manufacturing industry - Data centers and server farms

Problems Solved: - Overheating of integrated circuit packages with glass substrates - Inefficient cooling solutions for high-performance electronics

Benefits: - Improved cooling efficiency - Enhanced performance and reliability of integrated circuits - Extended lifespan of electronic devices

Commercial Applications: Title: Advanced Cooling Systems for Integrated Circuits with Glass Substrates This technology can be utilized in various commercial applications such as high-performance computing, telecommunications, and automotive electronics.

Questions about the Technology: 1. How does the cooling system for integrated circuit packages with glass substrates differ from traditional cooling methods? - The cooling system utilizes a glass core with a channel for cooling fluid flow, providing enhanced cooling efficiency compared to traditional methods.

2. What are the potential cost savings associated with implementing this cooling technology in electronic devices? - The improved cooling efficiency can lead to reduced energy consumption and maintenance costs, resulting in long-term cost savings for manufacturers and end-users.

Original Abstract Submitted

methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates are disclosed. an example glass core of an integrated circuit (ic) package disclosed herein includes a fluid inlet to receive a cooling fluid, a fluid outlet, and a channel to fluidly couple the fluid inlet to the fluid outlet, the cooling fluid to flow through the channel from the fluid inlet to the fluid outlet, the channel fluidly isolated from one or more vias extending between a first surface and a second surface of the glass core.