Intel corporation (20240211400). DISAGGREGATING A MEMORY SIDE CACHE DATA ARRAY AND CACHE CONTROLLER simplified abstract

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DISAGGREGATING A MEMORY SIDE CACHE DATA ARRAY AND CACHE CONTROLLER

Organization Name

intel corporation

Inventor(s)

Israel Diamand of Aderet M (IL)

Randy B. Osborne of Beaverton OR (US)

Aravindh V. Anantaraman of Folsom CA (US)

Nadav Bonen of Ofer Z (IL)

DISAGGREGATING A MEMORY SIDE CACHE DATA ARRAY AND CACHE CONTROLLER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240211400 titled 'DISAGGREGATING A MEMORY SIDE CACHE DATA ARRAY AND CACHE CONTROLLER

The semiconductor package described in the abstract includes a first die with multiple cores and memory circuitry, as well as a second die connected to the first die, which contains a data array for caching data for remote accelerators.

  • The semiconductor package comprises a first die with multiple cores and memory circuitry.
  • The memory circuitry includes a memory controller and a memory side cache controller for maintaining tag information and state information for a data array.
  • A second die is coupled to the first die and contains the data array to cache data for remote accelerators.
  • The memory side cache controller is responsible for controlling the data array.

Potential Applications: - High-performance computing systems - Data centers - Artificial intelligence and machine learning applications

Problems Solved: - Efficient data caching for remote accelerators - Improved memory management in multi-core systems

Benefits: - Enhanced performance in data-intensive applications - Optimal utilization of memory resources - Increased efficiency in processing large datasets

Commercial Applications: Title: "Advanced Semiconductor Package for High-Performance Computing" This technology can be utilized in high-performance computing systems, data centers, and AI applications to improve data processing and memory management, leading to faster and more efficient operations.

Questions about Semiconductor Package with Remote Accelerators: 1. How does the memory side cache controller enhance data caching for remote accelerators? The memory side cache controller maintains tag information and state information for the data array, optimizing data caching for remote accelerators.

2. What are the potential market implications of using this advanced semiconductor package in data centers and AI applications? The use of this technology can lead to improved performance and efficiency in data-intensive applications, making it a valuable asset for companies seeking to enhance their computing capabilities.


Original Abstract Submitted

in one embodiment, a semiconductor package comprises: a first die comprising: a plurality of cores; and memory circuitry comprising a memory controller and a memory side cache controller to maintain tag information and state information for a data array; and a second die coupled to the first die, the second die comprising the data array to cache data for at least one accelerator, the at least one accelerator remote from the first die. the memory side cache controller may be configured to control the data array. other embodiments are described and claimed.