Intel corporation (20240205167). SYSTEM-IN-PACKAGE NETWORK PROCESSORS simplified abstract
Contents
SYSTEM-IN-PACKAGE NETWORK PROCESSORS
Organization Name
Inventor(s)
Kevin Clark of San Jose CA (US)
Scott J. Weber of Piedmont CA (US)
Ravi Prakash Gutala of San Jose CA (US)
Aravind Raghavendra Dasu of Milpitas CA (US)
SYSTEM-IN-PACKAGE NETWORK PROCESSORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240205167 titled 'SYSTEM-IN-PACKAGE NETWORK PROCESSORS
The patent application relates to integrated circuit devices that consist of a network processor in a data processing die and an on-package memory in a base die. The data processing die can perform various network functionalities and communicate with high-capacity memory in the base die, providing low-latency data exchange. Additionally, the data processing die is programmable fabric that can be reconfigured dynamically during operation.
- The integrated circuit device includes a network processor and on-package memory for efficient data processing.
- The data processing die can implement multiple network functionalities and interact with high-capacity memory in the base die.
- The programmable fabric of the data processing die allows for dynamic reconfiguration during operation, enhancing flexibility and adaptability.
Potential Applications: - Networking equipment - Data centers - Telecommunications infrastructure
Problems Solved: - Low-latency data exchange between network processor and memory - Flexibility and adaptability in network functionality implementation
Benefits: - Improved data processing efficiency - Enhanced network performance - Dynamic reconfiguration capabilities
Commercial Applications: Title: "Advanced Integrated Circuit Devices for Efficient Data Processing" This technology can be utilized in networking equipment, data centers, and telecommunications infrastructure to enhance data processing capabilities and network performance.
Questions about Integrated Circuit Devices with Network Processor and On-Package Memory: 1. How does the dynamic reconfiguration of the programmable fabric in the data processing die impact overall performance? 2. What are the key advantages of having on-package memory in the base die for data exchange with the network processor?
Original Abstract Submitted
this disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. the data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. the data processing die may be programmable fabric, which may be dynamically reconfigured during operation.
