Intel corporation (20240204083). DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA simplified abstract

DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA

Organization Name

intel corporation

Inventor(s)

Gurpreet Singh of Portland OR (US)

Manish Chandhok of Beaverton OR (US)

Florian Gstrein of Portland OR (US)

Charles Henry Wallace of Portland OR (US)

Eungnak Han of Portland OR (US)

Leonard P. Guler of Hillsboro OR (US)

DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240204083 titled 'DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA

Simplified Explanation

The patent application discusses the use of DSA-based spacers and liners to provide shorting margins for vias connected to conductive structures. These spacers and liners are formed through the self-assembly of a diblock copolymer, creating insulative spacing structures that prevent short circuits between vias and other conductive structures.

• Spacers and liners are created through the self-assembly of a diblock copolymer.
• Spacers contain an electrical insulator and are placed over insulative structures.
• Liners wrap around the sides of spacers to create insulative spacing structures.
• These structures prevent short circuits between vias and other conductive structures.
• Different electrical insulators are used in the insulative spacing structures compared to the insulative structures.
• The conductive structures are arranged parallel to each other and function as contacts of a device.

Key Features and Innovation

• Use of DSA-based spacers and liners for shorting margins in vias.
• Self-assembly of a diblock copolymer to create insulative spacing structures.
• Different insulators used in the spacing structures compared to insulative structures.
• Prevents short circuits between vias and conductive structures.
• Parallel arrangement of conductive structures with similar heights.

Potential Applications

The technology can be applied in the manufacturing of electronic devices, integrated circuits, and semiconductor devices where preventing short circuits is crucial.

Problems Solved

The technology addresses the issue of short circuits between vias and conductive structures, improving the reliability and performance of electronic devices.

Benefits

• Enhanced reliability of electronic devices.
• Improved performance by preventing short circuits.
• Simplified manufacturing process for electronic components.

Commercial Applications

Title: "DSA-Based Spacers and Liners for Enhanced Shorting Margins in Electronic Devices" This technology can be utilized in the production of smartphones, computers, and other electronic devices to ensure reliable and efficient operation.

Prior Art

Further research can be conducted on diblock copolymer self-assembly techniques and their applications in electronic manufacturing processes.

Frequently Updated Research

Research on advanced materials for insulative spacing structures and their impact on electronic device performance is ongoing.

Questions about DSA-Based Spacers and Liners

How does the self-assembly of a diblock copolymer contribute to the creation of insulative spacing structures?

The self-assembly process allows for precise formation of spacers and liners with electrical insulators, providing shorting margins for vias.

What are the potential implications of using different insulators in the insulative spacing structures compared to the insulative structures?

Using different insulators can enhance the effectiveness of the spacing structures in preventing short circuits and improving device reliability.

Original Abstract Submitted

dsa-based spacers and liners can provide shorting margins for vias connected to conductive structures. self-assembly of a diblock copolymer may be performed over a layer including conductive structures and insulative structures separating the conductive structures from each other. spacers may be formed based on the self-assembly of the diblock copolymer. each spacer includes an electrical insulator and is over an insulative structure. each liner may wrap around one or more side surfaces of a spacer. each pair of spacer and liner constitutes an insulative spacing structure that provides a shorting margin to avoid short between a via and a conductive structure not connected to the via. the insulative spacing structures may include a different electrical insulator from the insulative structures. the conductive structures may be arranged in parallel along a direction and have the same or similar heights in the direction and function as different contacts of a device.