Intel corporation (20240203926). HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES simplified abstract

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HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

Organization Name

intel corporation

Inventor(s)

Feras Eid of Chandler AZ (US)

Joe Walczyk of Tigard OR (US)

Weihua Tang of Chandler AZ (US)

Akhilesh Rallabandi of Chandler AZ (US)

Marco Aurelio Cartas Ayala of Chandler AZ (US)

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203926 titled 'HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

The integrated circuit (IC) die structure described in the patent application consists of a substrate material made of silicon. The integrated circuitry is located on one side of the substrate material, while a composite layer is in direct contact with the opposite side of the substrate material.

  • The composite layer is made up of a first constituent material with a high coefficient of thermal expansion (CTE) and superior thermal conductivity compared to the substrate.
  • Additionally, the composite layer includes a second constituent material with a lower CTE and higher thermal conductivity than the substrate.

Key Features and Innovation:

  • The composite layer's unique composition allows for efficient heat dissipation and thermal expansion management in the IC die structure.
  • By combining materials with different thermal properties, the composite layer enhances the overall performance and reliability of the integrated circuit.

Potential Applications:

  • This technology can be applied in various electronic devices where thermal management is crucial, such as smartphones, computers, and automotive electronics.

Problems Solved:

  • Addresses issues related to thermal stress and heat dissipation in integrated circuits, improving their overall performance and longevity.

Benefits:

  • Enhanced thermal management capabilities lead to improved reliability and performance of integrated circuits.
  • Increased efficiency in heat dissipation can prolong the lifespan of electronic devices.

Commercial Applications:

  • This technology has significant commercial potential in the semiconductor industry, where efficient thermal management is essential for the development of advanced electronic devices.

Prior Art:

  • Researchers can explore prior studies on composite materials for thermal management in integrated circuits to understand the evolution of this technology.

Frequently Updated Research:

  • Stay informed about the latest advancements in composite materials for thermal management in integrated circuits to ensure the most up-to-date information on this technology.

Questions about Integrated Circuit Die Structure: 1. How does the composite layer in the IC die structure contribute to thermal management? 2. What are the potential applications of this technology beyond integrated circuits?


Original Abstract Submitted

an integrated circuit (ic) die structure comprises a substrate material comprising silicon. integrated circuitry is over a first side of the substrate material. a composite layer is in direct contact with a second side of the substrate material. the second side is opposite the first side. the composite layer comprises a first constituent material associated with a first linear coefficient of thermal expansion (cte), and a first thermal conductivity exceeding that of the substrate. the composite layer also comprises a second constituent material associated with a second cte that is lower than the first, and a second thermal conductivity exceeding that of the substrate.

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