Intel corporation (20240203853). DRY FILM PHOTORESIST WET LAMINATION AND METHOD simplified abstract

DRY FILM PHOTORESIST WET LAMINATION AND METHOD

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Julianne Troiano of Scottsdale AZ (US)

Dingying Xu of Chandler AZ (US)

Matthew Tingey of Mesa AZ (US)

Xiaoying Guo of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Bin Mu of Tempe AZ (US)

Kyle Mcelhinny of Tempe AZ (US)

Ashay A. Dani of Chandler AZ (US)

Leonel R. Arana of Phoenix AZ (US)

DRY FILM PHOTORESIST WET LAMINATION AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203853 titled 'DRY FILM PHOTORESIST WET LAMINATION AND METHOD

Simplified Explanation:

The patent application describes an electronic device with specific layers and components that work together to improve its functionality.

• The electronic device includes a substrate, a via, a build-up layer, a top layer, and one or more dies.
• The substrate has a conductor coating, and the via is connected to this coating.
• The build-up layer is on the substrate and insulates the via within a defined channel.
• The top layer is positioned near the substrate and via, while the dies are connected to the via.

Key Features and Innovation:

• Integration of specific layers and components to enhance the electronic device's performance.
• Use of a build-up layer to insulate the via and improve overall functionality.
• Connection of dies to the via for efficient operation.

Potential Applications:

The technology can be applied in various electronic devices such as smartphones, tablets, and computers.

Problems Solved:

The technology addresses the need for improved insulation and connectivity in electronic devices.

Benefits:

• Enhanced performance and functionality of electronic devices.
• Improved efficiency and reliability in operation.

Commercial Applications:

Potential commercial applications include the manufacturing of advanced electronic devices for consumer and industrial use.

Prior Art:

Readers can explore prior patents related to electronic device components and layers to understand the evolution of this technology.

Frequently Updated Research:

Stay updated on advancements in electronic device components and layers to enhance understanding and application of this technology.

Questions about Electronic Device Components and Layers:

1. What are the key components of the electronic device described in the patent application? 2. How does the build-up layer contribute to the functionality of the electronic device?

Original Abstract Submitted

an electronic device and associated methods are disclosed. in one example, the electronic device can include a substrate, a via, a build-up layer, a top layer, and one or more dies. the substrate can include a conductor coating. the via can be connected to the conductor coating. the build-up layer can be on the substrate. the build-up layer can define a channel that the via is formed within and insulate the via during operation of the electronic device. the top layer can be interproximal to the substrate and the via. the one or more dies can be connected to the via.