Intel corporation (20240203664). IN CORE LARGE AREA CAPACITORS simplified abstract

IN CORE LARGE AREA CAPACITORS

Organization Name

intel corporation

Inventor(s)

Yosef Kornbluth of Phoenix AZ (US)

Bainye Francoise Angoua of Phoenix AZ (US)

Whitney Bryks of Tempe AZ (US)

Daniel Rosales-yeomans of Gilbert AZ (US)

Aaditya Anand Candadai of Chandler AZ (US)

Holly Clingan of Chandler AZ (US)

Jade Sharee Lewis of Phoenix AZ (US)

Patrick Quach of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

IN CORE LARGE AREA CAPACITORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203664 titled 'IN CORE LARGE AREA CAPACITORS

The abstract describes a core for a package substrate, consisting of multiple layers including conductive and dielectric layers.

• The core includes a first substrate with a recess containing electrically conductive and dielectric layers.
• A second substrate with a recess containing another electrically conductive layer is also part of the core.
• The electrically conductive layers in the first and second substrates are in contact with each other.

Potential Applications:

• This technology can be used in electronic packaging for various devices.
• It can be applied in semiconductor manufacturing processes.

Problems Solved:

• Provides a compact and efficient solution for package substrates.
• Ensures proper electrical connectivity within the core.

Benefits:

• Improved electrical performance.
• Enhanced reliability in electronic devices.

Commercial Applications:

• This technology can be utilized in the production of integrated circuits and other electronic components.

Prior Art:

• Researchers can explore prior patents related to package substrates and electronic packaging technologies.

Frequently Updated Research:

• Stay updated on advancements in package substrate design and manufacturing processes.

Questions about the Technology: 1. How does this core design improve the performance of electronic devices? 2. What are the key advantages of using multiple layers in the core of a package substrate?

Original Abstract Submitted

embodiments disclosed herein include a core for a package substrate. in an embodiment, the core comprises a first substrate with a first surface and a second surface, a first recess into the first surface of the first substrate, a first layer in the first recess, where the first layer is electrically conductive, a second layer over the first layer, where the second layer is a dielectric layer, and a third layer over the second layer, where the third layer is electrically conductive. in an embodiment, the core further comprises a second substrate with a third surface and a fourth surface, where the third surface of the second substrate faces the first surface of the first substrate, a second recess in the third surface of the second substrate, and a fourth layer in the second recess, where the fourth layer is electrically conductive, and the fourth layer contacts the third layer.