Intel corporation (20240194657). INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract
Contents
INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
Organization Name
Inventor(s)
Suddhasattwa Nad of Chandler AZ (US)
Brandon Marin of Gilbert AZ (US)
Jeremy Ecton of Gilbert AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194657 titled 'INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
Simplified Explanation: The patent application describes integrating photonics integrated circuit devices and electronic integrated circuit devices into an assembly or module. It involves a module with a photonics integrated circuit device in a glass core substrate opening, and an electronic integrated circuit device directly bonded to the photonics integrated circuit device. An optical waveguide is present within or on the glass core substrate, with one end edge coupled to the photonics integrated circuit device.
Key Features and Innovation:
- Integration of photonics integrated circuit devices and electronic integrated circuit devices into a single module.
- Use of a glass core substrate to house the photonics integrated circuit device.
- Direct bonding of the electronic integrated circuit device to the photonics integrated circuit device.
- Presence of an optical waveguide within or on the glass core substrate.
Potential Applications: This technology could be used in telecommunications, data centers, optical networking, and high-speed computing applications.
Problems Solved:
- Simplifies the integration of photonics and electronic devices.
- Enhances the performance and efficiency of integrated modules.
- Reduces the footprint of integrated circuits.
Benefits:
- Improved functionality and performance.
- Enhanced reliability and durability.
- Cost-effective integration of different types of circuits.
Commercial Applications: The technology could find applications in telecommunications equipment, data center infrastructure, optical networking devices, and high-speed computing systems.
Prior Art: Readers can explore prior art related to integrated photonics and electronics integration in the field of optoelectronics and semiconductor device integration.
Frequently Updated Research: Researchers are continually exploring advancements in integrated photonics and electronics integration for improved performance and efficiency.
Questions about Integrated Photonics and Electronics Integration: 1. How does the direct bonding of electronic integrated circuit devices to photonics integrated circuit devices improve overall performance? 2. What are the potential challenges in scaling up the production of modules with integrated photonics and electronics?
Original Abstract Submitted
apparatuses, systems, assemblies, and techniques related to integrating photonics integrated circuit devices and electronic integrated circuit devices into an assembly or module are described. an integrated module includes a photonics integrated circuit device within an opening of a glass core substrate and an electronic integrated circuit device direct bonded to the photonics integrated circuit device. an optical waveguide is within or on the glass core substrate and has a terminal end edge coupled to the photonics integrated circuit device within the opening.
