Intel corporation (20240188225). GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS simplified abstract
Contents
- 1 GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Frequently Updated Research
- 1.11 Original Abstract Submitted
GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
Organization Name
Inventor(s)
Vinith Bejugam of Chandler AZ (US)
Rengarajan Shanmugam of Tempe AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Mao-Feng Tseng of Tempe AZ (US)
Yonggang Li of Chandler AZ (US)
GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240188225 titled 'GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
Simplified Explanation
The method described in the abstract involves manufacturing a structured substrate by forming openings in a glass substrate, depositing layers of materials on the sidewalls of the openings, and filling the openings with metal.
- Glass substrate with coplanar first and second surfaces
- Plurality of openings extending from the first surface towards the second surface
- Formation of a first layer on the sidewalls of the openings
- Formation of a second layer comprising titanium on the first layer
- Deposition of metal to fill the openings partially
Potential Applications
The structured substrate manufactured using this method could be used in microelectronics, optoelectronics, and sensor applications.
Problems Solved
This method solves the problem of creating structured substrates with precise and controlled features for various applications in the field of advanced materials.
Benefits
The structured substrate produced through this method offers improved performance, reliability, and efficiency in electronic devices and sensors.
Potential Commercial Applications
- Advanced microelectronics
- Optoelectronic devices
- Sensor technologies
Possible Prior Art
One possible prior art could be the use of similar methods for manufacturing structured substrates in the semiconductor industry.
== What are the limitations of this method in terms of scalability for mass production? == The method described in the patent application does not address the scalability of the manufacturing process for mass production. It would be essential to investigate the efficiency and cost-effectiveness of scaling up this method for large-scale production.
== How does the choice of materials impact the performance and durability of the structured substrate? == The materials chosen for the layers and filling of the openings can significantly impact the performance and durability of the structured substrate. Further research and testing would be necessary to optimize the material selection for specific applications.
Frequently Updated Research
There is ongoing research in the field of structured substrates for various applications, including advancements in materials, manufacturing processes, and performance optimization. Researchers are continually exploring new possibilities and improvements in this area.
Original Abstract Submitted
a method for manufacturing a structured substrate is provided, the method including: forming a plurality of openings extending from a first surface of a substrate towards a second surface of the substrate, wherein the first surface is coplanar to the second surface, wherein the substrate comprises glass, and wherein each of the openings comprises a sidewall; forming a first layer at least on the sidewall of the openings; forming a second layer on the first layer, wherein the second layer comprises titanium; and depositing metal on the second layer to at least partially fill the openings.
